DLPS258 August   2025 DLP472NP

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
   1. 4.1 Pin Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  Storage Conditions
   3. 5.3  ESD Ratings
   4. 5.4  Recommended Operating Conditions
   5.     12
   6. 5.5  Thermal Information
   7. 5.6  Electrical Characteristics
   8. 5.7  Switching Characteristics
   9. 5.8  Timing Requirements
   10.     17
   11. 5.9  System Mounting Interface Loads
   12.     19
   13. 5.10 Micromirror Array Physical Characteristics
   14. 5.11 Micromirror Array Optical Characteristics
   15.     22
   16. 5.12 Window Characteristics
   17. 5.13 Chipset Component Usage Specification
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 LPSDR Low-Speed Interface
      3. 6.3.3 High-Speed Interface
      4. 6.3.4 Timing
   4. 6.4 Device Functional Modes
   5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
   6. 6.6 Micromirror Array Temperature Calculation
   7. 6.7 Micromirror Power Density Calculation
   8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 7 Application and Implementation
   1. 7.1 Application Information
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
   3. 7.3 Temperature Sensor Diode
9. 8 Power Supply Recommendations
   1. 8.1 DMD Power Supply Power-Up Procedure
   2. 8.2 DMD Power Supply Power-Down Procedure
10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
       1. 10.2.1 Device Nomenclature
       2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
       1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information