DLPS258 August   2025 DLP472NP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1. 4.1 Pin Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     12
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Switching Characteristics
    9. 5.8  Timing Requirements
    10.     17
    11. 5.9  System Mounting Interface Loads
    12.     19
    13. 5.10 Micromirror Array Physical Characteristics
    14. 5.11 Micromirror Array Optical Characteristics
    15.     22
    16. 5.12 Window Characteristics
    17. 5.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 LPSDR Low-Speed Interface
      3. 6.3.3 High-Speed Interface
      4. 6.3.4 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Temperature Sensor Diode
  9. Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

Over operating free-air temperature range (unless otherwise noted) (1)
MINNOMMAXUNIT
LPSDR
tfFall slew rate (2)(80% to 20%) × VDD(5)0.25V/ns
tcCycle time LS_CLK(5)50% to 50% reference points(5)7.78.3ns
trRise slew rate (1)(30% to 80%) × VDD(6)13V/ns
tfFall slew rate (1)(70% to 20%) x VDD(6)13V/ns
trRise slew rate (2)(20% to 80%) × VDD(6)0.25V/ns
tW(H)Pulse duration LS_CLK high50% to 50% reference points(5)3.1ns
tW(L)Pulse duration LS_CLK low50% to 50% reference points(5)3.1ns
tWINDOWWindow time(1)(3)Setup time + Hold time(5)3ns
tDERATINGWindow time derating(1)(3)For each 0.25V/ns reduction in slew rate below 1 V/ns(8)0.35ns
tsuSetup timeLS_WDATA valid before LS_CLK(5)1.5ns
thHold timeLS_WDATA valid after LS_CLK(5)1.5ns
SubLVDS
trRise slew rate20% to 80% reference points(7)0.71V/ns
tfFall slew rate80% to 20% reference points(7)0.71V/ns
tcCycle time D_CLK(9)50% to 50% reference points(9)1.351.39ns
tW(H)Pulse duration DCLK high50% to 50% reference points(9)0.7ns
tW(L)Pulse duration DCLK low50% to 50% reference points(9)0.7ns
tsuSetup timeDATA valid before D_CLK(9)0.17ns
thHold timeDATA valid after D_CLK(9)0.17ns
tWINDOWWindow timeSetup time + Hold time(9)(10)0.25ns
tPOWERPower-up receiver(4)200ns
Specification is for LS_CLK and LS_WDATA pins. Refer to the LPSDR input rise and fall slew rate in Figure 5-3.
Specification is for the DMD_DEN_ARSTZ pin. Refer to the LPSDR input rise and fall slew rate in Figure 5-3.
Window time derating example: 0.5V/ns slew rate increases the window time by 0.7ns, from 3ns to 3.7ns.
The specification is for SubLVDS receiver time only and does not take into account commanding and latency after commanding.
See Figure 5-2.
See Figure 5-3.
See Figure 5-4.
See Figure 5-5.
See Figure 5-6.
See Figure 5-7.