DLPS282 Data sheet

DLPS282 July 2025 DLP473TE

PRODUCTION DATA

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Mechanical Data (Package|Pins)

FXL|173
- MCPG039A

Thermal pad, mechanical data (Package|Pins)

Orderable Information

5.4 Recommended Operating Conditions

Over operating free-air temperature range and supply voltages (unless otherwise noted). The functional performance of the device specified in this data sheet is achieved when operating the device within the limits defined by the Recommended Operating Conditions. No level of performance is implied when operating the device above or below the Recommended Operating Conditions limits.

		MIN	TYP	MAX	UNIT
SUPPLY VOLTAGE RANGE
V_DD	Supply voltage for LVCMOS core logic⁽¹⁾⁽²⁾ Supply voltage for LPSDR low-speed interface	1.71	1.8	1.95	V
V_DDI	Supply voltage for SubLVDS receivers⁽¹⁾⁽²⁾	1.71	1.8	1.95	V
V_OFFSET	Supply voltage for HVCMOS and micromirror electrode⁽¹⁾⁽²⁾⁽³⁾	9.5	10	10.5	V
V_BIAS	Supply voltage for mirror electrode⁽¹⁾⁽²⁾	17.5	18	18.5	V
V_RESET	Supply voltage for micromirror electrode⁽¹⁾⁽²⁾	–14.5	–14	–13.5	V
\|V_DDI - V_DD\|	Supply voltage delta (absolute value)⁽¹⁾⁽²⁾⁽⁴⁾			0.3	V
\|V_BIAS-V_OFFSET\|	Supply voltage delta (absolute value)⁽¹⁾⁽²⁾⁽⁵⁾			10.5	V
\|V_BIAS - V_RESET\|	Supply voltage delta (absolute value)⁽¹⁾⁽²⁾⁽⁶⁾			33	V
CLOCK FREQUENCY
f_clock	Clock frequency for low speed interface LS_CLK⁽⁷⁾	108		120	MHz
f_clock	Clock frequency for high-speed interface DCLK⁽⁸⁾			720	MHz
DCD_IN	Duty cycle distortion	48%		52%
DCD_OUT	Duty cycle distortion	44%	50%	56%
SUBLVDS INTERFACE
\|V_ID\|	LVDS differential input voltage magnitude⁽⁸⁾	150	250	350	mV
V_CM	Common mode voltage⁽⁸⁾	700	900	1100	mV
V_SUBLVDS	SubLVDS voltage⁽⁸⁾	525		1275	mV
Z_LINE	Line differential impedance (PWB/trace)	90	100	110	Ω
Z_IN	Internal differential termination resistance⁽¹⁰⁾	80	100	120	Ω
	100Ω differential PCB trace	6.35		152.4	mm
ENVIRONMENTAL
T_ARRAY	Array temperature, long-term operation⁽⁹⁾⁽¹⁰⁾⁽¹¹⁾⁽¹²⁾	10		40 to 70	°C
T_ARRAY	Array temperature, short-term operation, 500 hr max⁽¹⁰⁾⁽¹³⁾	0		10	°C
T_DP-AVG	Average dew point temperature, (non-condensing)⁽¹⁴⁾			28	°C
T_DP-ELR	Elevated dew point temperature range, (non-condensing)⁽¹⁵⁾		28	36	°C
CT_ELR	Cumulative time in elevated dew point temperature range			28	Months
Q_AP-LL	Window Aperture illumination overfill⁽¹⁶⁾⁽¹⁷⁾⁽¹⁸⁾			17	W/cm²
ILLUMINATION LPCW, RGB Laser and LED
ILL_UV	Illumination, wavelength < 410nm⁽⁹⁾⁽²⁰⁾			10	mW/cm²
ILL_VIS	Illumination power at wavelengths ≥ 410nm and ≤ 800nm⁽¹⁹⁾⁽²⁰⁾			60	W/cm²
ILL_IR	Illumination, wavelength between > 800nm⁽²⁰⁾			10	mW/cm²
ILL_BLU	Illumination power at wavelengths ≥ 410nm and ≤ 475nm⁽¹⁹⁾⁽²⁰⁾			19.5	W/cm²
ILL_BLU1	Illumination power at wavelengths ≥ 410nm and ≤ 440nm⁽¹⁹⁾⁽²⁰⁾			3.06	W/cm²

(1) The following power supplies are required to operate the DMD: V_DD, V_DDI, V_OFFSET, V_BIAS, and V_RESET. All V_SS connections are required to operate the DMD.

(2) All voltage values are with respect to the V_SS ground pins.

(3) V_OFFSETsupply transients must fall within the specified max voltages.

(4) To prevent excess current, the supply voltage delta |V_DDI – V_DD| must be less than the specified limit.

(5) To prevent excess current, the supply voltage delta |V_BIAS – V_OFFSET| must be less than the specified limit.

(6) To prevent excess current, the supply voltage delta |V_BIAS – V_RESET| must be less than the specified limit.

(7) LS_CLK must run as specified to ensure internal DMD timing for reset waveform commands.

(8) Refer to the SubLVDS timing requirements in Timing Requirements.

(9) Simultaneous exposure of the DMD to the maximum Recommended Operating Conditions for temperature and UV illumination will reduce device lifetime.

(10) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point (TP1) and the package thermal resistance using the Micromirror Array Temperature Calculation.

(11) The maximum operational array temperature is derated based on the micromirror landed duty cycle that the DMD experiences in the end application. See the Section 6.9.1 section for a definition of micromirror landed duty cycle.

(12) Long-term is defined as the usable life of the device.

(13) Short-term is the total cumulative time over the useful life of the device.

(14) The average over time (including storage and operating) that the device is not in the elevated dew point temperature range.

(15) Exposure to dew point temperatures in the elevated range during storage and operation is limited to less than a total cumulative time of CT_ELR.

(16) Applies to the region defined in the Figure 5-2.

(17) The active area of the DMD is surrounded by an aperture on the inside of the DMD window surface that masks structures of the DMD device assembly from normal view. The aperture is sized to anticipate several optical conditions. Overfill light illuminating the area outside the active array can scatter and create adverse effects to the performance of an end application using the DMD. Minimizing the light flux incident outside the active array is a design requirement of the illumination optical system. Depending on the particular optical architecture and assembly tolerances of the optical system, the amount of overfill light on the outside of the active array may cause system performance degradation.

(18) To calculate, see the Section 6.8.

(19) The maximum allowable optical power incident on the DMD is limited by the maximum optical power density for each wavelength range specified and the micromirror array temperature (T_ARRAY).

(20) To calculate, see the Section 6.7.