DLPS013G April   2010  – January 2019 DLP5500

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  System Mounting Interface Loads
    9. 7.9  Micromirror Array Physical Characteristics
    10. 7.10 Micromirror Array Optical Characteristics
    11. 7.11 Window Characteristics
    12. 7.12 Chipset Component Usage Specification
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Video Modes
      2. 8.4.2 Structured Light Modes
        1. 8.4.2.1 Static Image Buffer Mode
        2. 8.4.2.2 Real Time Structured Light Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation for Uniform Illumination
    7. 8.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLP5500 System Interface
  10. 10Power Supply Recommendations
    1. 10.1 DMD Power-Up and Power-Down Procedures
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Documentation
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.6.3 Micromirror Array Temperature Calculation for Uniform Illumination

Micromirror array temperature cannot be measured directly; therefore it must be computed analytically from measurement points (Figure 16), the package thermal resistance, the electrical power, and the illumination heat load. The relationship between micromirror array temperature and the case temperature are provided by Equation 1 and Equation 2:

Equation 1. TArray = TCeramic + (QArray x RArray-To-Ceramic)
Equation 2. QArray = QELE + QILL

where

  • TArray = computed micromirror array temperature (°C)
  • TCeramic = Ceramic temperature (°C) (TC2 Location Figure 16)
  • QArray = Total DMD array power (electrical + absorbed) (measured in Watts)
  • RArray-To-Ceramic = thermal resistance of DMD package from array to TC2 (°C/Watt) (see Package Thermal Resistance)
  • QELE = Nominal electrical power (Watts)
  • QILL = Absorbed illumination energy (Watts)

An example calculation is provided below based on a traditional DLP Video projection system. The electrical power dissipation of the DMD is variable and depends on the voltages, data rates, and operating frequencies. The nominal electrical power dissipation to be used in the calculation is 2.0 Watts. Thus, QELE = 2.0 Watts. The absorbed power from the illumination source is variable and depends on the operating state of the mirrors and the intensity of the light source. It's based on modeling and measured data from DLP projection system.

Equation 3. QILL = CL2W x SL

where

  • CL2W is a Lumens to Watts constant, and can be estimated at 0.00274 Watt/Lumen
  • SL = Screen Lumens nominally measured to be 2000 lumens
  • Qarray = 2.0 + (0.00274 x 2000) = 7.48 watts, Estimated total power on micromirror Array
  • TCeramic = 55°C, assumed system measurement
  • TArray(micromirror active array temperature) = 55°C + (7.48 watts x 0.6 °C/watt) = 59.5°C

For additional explanation of DMD Mechanical and Thermal calculations and considerations please refer to DLP Series-450 DMD and System Mounting Concepts (DLPA015).