DLPS073F March   2016  – May 2019 DLP5530-Q1


  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      DLP5530-Q1 DLP Chipset System Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions – Connector Pins
    2.     Pin Functions – Test Pads
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sub-LVDS Data Interface
      2. 7.3.2 Low Speed Interface for Control
      3. 7.3.3 DMD Voltage Supplies
      4. 7.3.4 Asynchronous Reset
      5. 7.3.5 Temperature Sensing Diode
        1. Temperature Sense Diode Theory
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application Overview
      2. 8.2.2 Reference Design
      3. 8.2.3 Application Mission Profile Consideration
  9. Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 DMD Handling
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • FYK|149
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Overview

Figure 20 shows the system block diagram for a DLP HUD system. The system uses the DLPC230-Q1, TPS99000-Q1, and the DLP5530-Q1 automotive DMD to enable a head-up display with high brightness, high efficiency, and a large virtual image distance. The combination of the DLPC230-Q1 and TPS99000-Q1 removes the need for external SDRAM and a dedicated microprocessor. The chipset manages the illumination control of LED sources, power sequencing functions, and system management functions. Additionally, the chipset supports numerous system diagnostic and built-in self test (BIST) features. The following paragraphs describe the functionality of the chipset used for a HUD system in more detail.

The DLPC230-Q1 is a controller for the DMD and the light sources in the DLP HUD module. It receives input video from the host and synchronizes DMD and light source timing in order to achieve the desired video. The DLPC230-Q1 formats input video data that is displayed on the DMD. It synchronizes these video segments with light source timing in order to create a video with a multi-colored display.

The DLPC230-Q1 receives inputs from a host processor in the vehicle. The host provides commands and input video data. Host commands can be sent using either the I2C bus or SPI bus. The bus that is not being used for host commands can be used as a read-only bus for diagnostic purposes. Input video can be sent over an OpenLDI bus or a parallel 24-bit bus. The SPI flash memory provides the embedded software for the DLPC230-Q1’s ARM core and default settings. The provides diagnostic and monitoring information to the DLPC230-Q1 using an SPI bus and several other control signals such as PARKZ, INTZ, and RESETZ to manage power-up and power-down sequencing. The TMP411 uses an I2C interface to provide the DMD array temperature to the DLPC230-Q1.

The outputs of the DLPC230-Q1 are configuration and monitoring commands to the , timing controls to the LED or laser driver, control and data signals to the DMD, and monitoring and diagnostics information to the host processor. The DLPC230-Q1 communicates with the over an SPI bus. It uses this to configure the and to read monitoring and diagnostics information from the . The DLPC230-Q1 sends drive enable signals to the LED or laser driver, and synchronizes this with the DMD mirror timing. The control signals to the DMD are sent using a sub-LVDS interface.

The is a highly integrated mixed-signal IC that controls DMD power and provides monitoring and diagnostics information for the DLP HUD system. The power sequencing and monitoring blocks of the properly power up the DMD and provide accurate DMD voltage rails (–16 V, 8.5 V, and 10 V), and then monitor the system’s power rails during operation. The integration of these functions into one IC significantly reduces design time and complexity.

The receives inputs from the DLPC230-Q1, the power rails it monitors, the host processor, and potentially several other ADC ports. The DLPC230-Q1 sends configuration and control commands to the over an SPI bus and several other control signals. The DLPC230-Q1’s clocks are also monitored by the watchdogs in the to detect any errors. The power rails are monitored by the in order to detect power failures or glitches and request a proper power down of the DMD in case of an error. The host processor can read diagnostics information from the using a dedicated SPI bus, which enables independent monitoring. Additionally the host can request the image to be turned on or off using a PROJ_ON signal. Lastly, the has several general-purpose ADCs that can be used to implement system level monitoring functions.

The outputs of the are diagnostic information and error alerts to the DLPC230-Q1, and control signals to the LED or laser driver. The can output diagnostic information to the host and the DLPC230-Q1 over two SPI buses. In case of critical system errors, such as power loss, it outputs signals to the DLPC230-Q1 that trigger power down or reset sequences. It also has output signals that can be used to implement various LED or laser driver topologies.

The DMD is a micro-electro-mechanical system (MEMS) device that receives electrical signals as an input (video data), and produces a mechanical output (mirror position). The electrical interface to the DMD is a sub-LVDS interface with the DLPC230-Q1. The mechanical output is the state of more than 1.3 million mirrors in the DMD array that can be tilted ±12°. In a projection system the mirrors are used as pixels in order to display an image.