DLPS026F August 2012 – June 2019 DLP7000
General decoupling capacitors for the DLP7000 should be distributed around the PCB and placed to minimize the distance from IC voltage and ground pads. Each decoupling capacitor (0.1 µF recommended) should have vias directly to the ground and power planes. Via sharing between components (discreet or integrated) is discouraged. The power and ground pads of the DLP7000 should be tied to the voltage and ground planes with their own vias.