DLPS026F August 2012 – June 2019 DLP7000
When designing a PCB for the DLP7000 controlled by the DLPC410 in conjunction with the DLPA200, the following are recommended:
Signal trace corners should be no sharper than 45°. Adjacent signal layers should have the predominate traces routed orthogonal to each other. TI recommends that critical signals be hand routed in the following order: DDR2 Memory, DMD (LVDS signals), then DLPA200 signals.
TI does not recommend signal routing on power or ground planes.
TI does not recommend ground plane slots.
High speed signal traces should not cross over slots in adjacent power and/or ground planes.
DMD_DCKL_xn, and DMD_SCTRL_xn)
|P-to-N data, clock, and SCTRL: <10 mils (0.25 mm); Pair-to-pair <10 mils (0.25 mm); Bundle-to-bundle <2000 mils (50 mm, for example DMD_DAT_Ann to DMD_DAT_Bnn)
Trace width: 4 mil (0.1 mm)
Trace spacing: In ball field – 4 mil (0.11 mm); PCB etch – 14 mil (0.36 mm)
Maximum recommended trace length <6 inches (150 mm)
|SIGNAL NAME||MINIMUM TRACE WIDTH||MINIMUM TRACE SPACING||LAYOUT REQUIREMENTS|
|GND||Maximize||5 mil (0.13 mm)||Maximize trace width to connecting pin as a minimum|
|VCC, VCC2||20 mil (0.51 mm)||10 mil (0.25 mm)|
|MBRST[15:0]||11 mil (0.23 mm)||15 mil (0.38 mm)|