DLPS243B October   2022  – September 2023 DLP801XE

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5.     12
    6. 6.5  Thermal Information
    7. 6.6  Electrical Characteristics
    8. 6.7  Timing Requirements
    9.     16
    10. 6.8  System Mounting Interface Loads
    11.     18
    12. 6.9  Micromirror Array Physical Characteristics
    13.     20
    14. 6.10 Micromirror Array Optical Characteristics
    15.     22
    16. 6.11 Window Characteristics
    17. 6.12 Chipset Component Usage Specification
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Power Density Calculation
    8. 7.8 Window Aperture Illumination Overfill Calculation
    9. 7.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.9.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.9.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.9.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Temperature Sensor Diode
  10. 9 Power Supply Recommendations
    1. 9.1 DMD Power Supply Requirements
    2. 9.2 DMD Power Supply Power-Up Procedure
    3. 9.3 DMD Power Supply Power-Down Procedure
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Layers
      2. 10.2.2 Impedance Requirements
      3. 10.2.3 Trace Width, Spacing
        1. 10.2.3.1 Voltage Signals
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
    3. 11.3 Device Markings
    4. 11.4 Documentation Support
      1. 11.4.1 Related Documentation
    5. 11.5 Receiving Notification of Documentation Updates
    6. 11.6 Support Resources
    7. 11.7 Trademarks
    8. 11.8 Electrostatic Discharge Caution
    9. 11.9 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

8.3 Temperature Sensor Diode

The DMD features a built-in thermal diode that measures the temperature at one corner of the die outside the micromirror array. The thermal diode can be interfaced with the TMP411 temperature sensor as shown in Figure 8-4. The software application contains functions to configure the TMP411 to read the DLP801XE DMD temperature sensor diode. This data can be leveraged by the customer to incorporate additional functionality in the overall system design such as adjusting illumination, fan speeds, etc. All communication between the TMP411 and the DLPC4420 display controller happens over the I2C interface. The TMP411 connects to the DMD through the pins outlined in Section 5.

Leave TEMP_N and TEMP_P pins unconnected (NC) if the temp sensor is not used.

GUID-20220829-SS0I-Q67Z-WLT4-FQGRG8GLXNT8-low.svg
A. Details omitted for clarity.
B. See the TMP411 datasheet for system board layout recommendation.
C. See the TMP411 datasheet and the TI reference design for suggested component values for R1, R2, R3, R4, and C1.
D. R5 = 0 Ω. R6 = 0 Ω. Place 0-Ω resistors close to the DMD package pins.
Figure 8-4 TMP411 Sample Schematic