DLPS052
October 2015
DLPA3000
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Block Diagram
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
SPI Timing Parameters
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Supply and Monitoring
7.3.1.1
Supply
7.3.1.2
Monitoring
7.3.1.2.1
Block Faults
7.3.1.2.2
Low Battery and UVLO
7.3.1.2.3
Auto LED Turn Off Functionality
7.3.1.2.4
Thermal Protection
7.3.2
Illumination
7.3.2.1
Programmable Gain Block
7.3.2.2
LDO Illum
7.3.2.3
Illumination Driver A
7.3.2.4
RGB Strobe Decoder
7.3.2.4.1
Break Before Make (BBM)
7.3.2.4.2
Openloop Voltage
7.3.2.4.3
Transient Current Limit
7.3.2.5
Illumination Monitoring
7.3.2.5.1
Power Good
7.3.2.5.2
Ratio Metric Overvoltage Protection
7.3.2.6
Load Current and Supply Voltage
7.3.2.7
Illumination Driver Plus Power FETS Efficiency
7.3.3
DMD Supplies
7.3.3.1
LDO DMD
7.3.3.2
DMD HV Regulator
7.3.3.2.1
Power-Up and Power-Down Timing
7.3.3.3
DMD/DLPC Buck Converters
7.3.3.4
DMD Monitoring
7.3.3.4.1
Power Good
7.3.3.4.2
Overvoltage Fault
7.3.4
Buck Converters
7.3.4.1
LDO Bucks
7.3.4.2
General Purpose Buck Converters
7.3.4.3
Buck Converter Monitoring
7.3.4.3.1
Power Good
7.3.4.3.2
Overvoltage Fault
7.3.4.4
Buck Converter Efficiency
7.3.5
Auxiliary LDOs
7.3.6
Measurement System
7.3.7
Digital Control
7.3.7.1
SPI
7.3.7.2
Interrupt
7.3.7.3
Fast-Shutdown in Case of Fault
7.3.7.4
Protected Registers
7.3.7.5
Writing to EEPROM
7.4
Device Functional Modes
7.5
Register Maps
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
Typical Application Setup Using DLPA3000
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
8.2.2
Typical Application with DLPA3000 Internal Block Diagram
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.3
SPI Connections
10.4
RLIM Routing
10.5
LED Connection
10.6
Thermal Considerations
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.2
Related Links
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
12.1
Package Option Addendum
12.1.1
Packaging Information
Package Options
Mechanical Data (Package|Pins)
PFD|100
MPQF054B
Thermal pad, mechanical data (Package|Pins)
PFD|100
PPTD321
4
Revision History
DATE
REVISION
NOTES
October 2015
*
Initial release.