DLPS052 October   2015 DLPA3000

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Parameters
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply and Monitoring
        1. 7.3.1.1 Supply
        2. 7.3.1.2 Monitoring
          1. 7.3.1.2.1 Block Faults
          2. 7.3.1.2.2 Low Battery and UVLO
          3. 7.3.1.2.3 Auto LED Turn Off Functionality
          4. 7.3.1.2.4 Thermal Protection
      2. 7.3.2 Illumination
        1. 7.3.2.1 Programmable Gain Block
        2. 7.3.2.2 LDO Illum
        3. 7.3.2.3 Illumination Driver A
        4. 7.3.2.4 RGB Strobe Decoder
          1. 7.3.2.4.1 Break Before Make (BBM)
          2. 7.3.2.4.2 Openloop Voltage
          3. 7.3.2.4.3 Transient Current Limit
        5. 7.3.2.5 Illumination Monitoring
          1. 7.3.2.5.1 Power Good
          2. 7.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 7.3.2.6 Load Current and Supply Voltage
        7. 7.3.2.7 Illumination Driver Plus Power FETS Efficiency
      3. 7.3.3 DMD Supplies
        1. 7.3.3.1 LDO DMD
        2. 7.3.3.2 DMD HV Regulator
          1. 7.3.3.2.1 Power-Up and Power-Down Timing
        3. 7.3.3.3 DMD/DLPC Buck Converters
        4. 7.3.3.4 DMD Monitoring
          1. 7.3.3.4.1 Power Good
          2. 7.3.3.4.2 Overvoltage Fault
      4. 7.3.4 Buck Converters
        1. 7.3.4.1 LDO Bucks
        2. 7.3.4.2 General Purpose Buck Converters
        3. 7.3.4.3 Buck Converter Monitoring
          1. 7.3.4.3.1 Power Good
          2. 7.3.4.3.2 Overvoltage Fault
        4. 7.3.4.4 Buck Converter Efficiency
      5. 7.3.5 Auxiliary LDOs
      6. 7.3.6 Measurement System
      7. 7.3.7 Digital Control
        1. 7.3.7.1 SPI
        2. 7.3.7.2 Interrupt
        3. 7.3.7.3 Fast-Shutdown in Case of Fault
        4. 7.3.7.4 Protected Registers
        5. 7.3.7.5 Writing to EEPROM
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Setup Using DLPA3000
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Typical Application with DLPA3000 Internal Block Diagram
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 SPI Connections
    4. 10.4 RLIM Routing
    5. 10.5 LED Connection
    6. 10.6 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

SPI Connections

The SPI interface consists of several digital lines and the SPI supply. If routing of the interface lines is not done properly, communication errors can occur. It should be prevented that SPI lines can pickup noise and possible interfering sources should be kept away from the interface.

Pickup of noise can be prevented by ensuring that the SPI ground line is routed together with the digital lines as much as possible to the respective pins. The SPI interface should be connected by a separate own ground connection to the DGND of the DLPA3000 (Figure 32). This prevents ground noise between SPI ground references of DLPA3000 and DLPC due to the high current in the system.

DLPA3000 SPI_Routing.gifFigure 32. SPI Connections

Interfering sources should be kept away from the interface lines as much as possible. High-current lines, such as neighboring PWR_7, should especially be routed carefully. If PWR 7 is routed too close to SPI_CLK, for example, it could lead to false clock pulses and thus communication errors.