DLPS052 October   2015 DLPA3000

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Parameters
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply and Monitoring
        1. 7.3.1.1 Supply
        2. 7.3.1.2 Monitoring
          1. 7.3.1.2.1 Block Faults
          2. 7.3.1.2.2 Low Battery and UVLO
          3. 7.3.1.2.3 Auto LED Turn Off Functionality
          4. 7.3.1.2.4 Thermal Protection
      2. 7.3.2 Illumination
        1. 7.3.2.1 Programmable Gain Block
        2. 7.3.2.2 LDO Illum
        3. 7.3.2.3 Illumination Driver A
        4. 7.3.2.4 RGB Strobe Decoder
          1. 7.3.2.4.1 Break Before Make (BBM)
          2. 7.3.2.4.2 Openloop Voltage
          3. 7.3.2.4.3 Transient Current Limit
        5. 7.3.2.5 Illumination Monitoring
          1. 7.3.2.5.1 Power Good
          2. 7.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 7.3.2.6 Load Current and Supply Voltage
        7. 7.3.2.7 Illumination Driver Plus Power FETS Efficiency
      3. 7.3.3 DMD Supplies
        1. 7.3.3.1 LDO DMD
        2. 7.3.3.2 DMD HV Regulator
          1. 7.3.3.2.1 Power-Up and Power-Down Timing
        3. 7.3.3.3 DMD/DLPC Buck Converters
        4. 7.3.3.4 DMD Monitoring
          1. 7.3.3.4.1 Power Good
          2. 7.3.3.4.2 Overvoltage Fault
      4. 7.3.4 Buck Converters
        1. 7.3.4.1 LDO Bucks
        2. 7.3.4.2 General Purpose Buck Converters
        3. 7.3.4.3 Buck Converter Monitoring
          1. 7.3.4.3.1 Power Good
          2. 7.3.4.3.2 Overvoltage Fault
        4. 7.3.4.4 Buck Converter Efficiency
      5. 7.3.5 Auxiliary LDOs
      6. 7.3.6 Measurement System
      7. 7.3.7 Digital Control
        1. 7.3.7.1 SPI
        2. 7.3.7.2 Interrupt
        3. 7.3.7.3 Fast-Shutdown in Case of Fault
        4. 7.3.7.4 Protected Registers
        5. 7.3.7.5 Writing to EEPROM
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Setup Using DLPA3000
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Typical Application with DLPA3000 Internal Block Diagram
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 SPI Connections
    4. 10.4 RLIM Routing
    5. 10.5 LED Connection
    6. 10.6 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

7.3.1.2.4 Thermal Protection

The chip temperature is constantly monitored to prevent overheating of the device. There are two levels of fault condition (register 0x0C). The first is to warn for overheating (TS_WARN). This is an indication that the chip temperature raises to a critical temperature. The next level of warning is TS_SHUT. This occurs at a higher temperature than TS_WARN and will shutdown the chip to prevent permanent damage. Both temperature faults have hysteresis on their levels to prevent rapid switching around the temperature threshold.