DLPS030E December 2013 – March 2019 DLPC2607
Refer to the PDF data sheet for device specific package drawings
SC: Solder ball composition
e1: Indicates lead-free solder balls consisting of SnAgCu
G8: Indicates lead-free solder balls consisting of tin-silver-copper (SnAgCu) with silver content ≤1.5% and that the mold compound meets TI's definition of green
AB (1 or 2 alphanumeric) = ‘A’ corresponds to the TI device dash number. ‘B’ is reserved for an unqualified device marking. All unqualified devices, including prototypes and skew lot samples, are labeled with the letter 'X' in the ‘B’ marking location (following the TI part number). ‘B’ is left blank for qualified devices.
LLLLLLLL: Manufacturing lot code
ZZ: Lot split number
SSSSS: Manufacturing site
YYWW: Date code (YY = Year :: WW = Week)
QQ: Qualification level option – engineering samples are marked in this field with an ES suffix.
For example, KOREA0914ES are engineering samples built in Korea the 14th week of 2009.