DLPS030E December   2013  – March 2019 DLPC2607

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Typical Current and Power Dissipation
    6. 6.6  I/O Characteristics
    7. 6.7  Internal Pullup and Pulldown Characteristics
    8. 6.8  Parallel I/F Frame Timing Requirements
    9. 6.9  Parallel I/F General Timing Requirements
    10. 6.10 Parallel I/F Maximum Parallel Interface Horizontal Line Rate
    11. 6.11 BT.656 I/F General Timing Requirements
    12. 6.12 100- to 120-Hz Operational Limitations
    13. 6.13 Flash Interface Timing Requirements
    14. 6.14 DMD Interface Timing Requirements
    15. 6.15 mDDR Memory Interface Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Parallel Bus Interface
      2. 7.3.2 100- to 120-Hz 3-D Display Operation
    4. 7.4 Programming
      1. 7.4.1 Serial Flash Interface
      2. 7.4.2 Serial Flash Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 System Functional Modes
      2. 8.2.2 Design Requirements
        1. 8.2.2.1 Reference Clock
        2. 8.2.2.2 mDDR DRAM Compatibility
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Hot-Plug Usage
        2. 8.2.3.2 Maximum Signal Transition Time
        3. 8.2.3.3 Configuration Control
        4. 8.2.3.4 White Point Correction Light Sensor
      4. 8.2.4 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 System Power Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 System Power I/O State Considerations
    4. 9.4 Power-Up Initialization Sequence
    5. 9.5 Power-Good (PARK) Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  Internal ASIC PLL Power
      2. 10.1.2  General Handling Guidelines for Unused CMOS-Type Pins
      3. 10.1.3  SPI Signal Routing
      4. 10.1.4  mDDR Memory and DMD Interface Considerations
      5. 10.1.5  PCB Design
      6. 10.1.6  General PCB Routing (Applies to All Corresponding PCB Signals)
      7. 10.1.7  Maximum, Pin-to-Pin, PCB Interconnects Etch Lengths
      8. 10.1.8  I/F Specific PCB Routing
      9. 10.1.9  Number of Layer Changes
      10. 10.1.10 Stubs
      11. 10.1.11 Termination Requirements:
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Marking
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZVB|176
Thermal pad, mechanical data (Package|Pins)

4 Revision History

Changes from D Revision (May 2017) to E Revision

  • Changed Changed title from "DLPC2607 DLP PICO Processor 2607 ASIC" to "DLPC2607 Low-power DLP® Display Controller" Go
  • Added ZVB Package Bottom View Go
  • Changed to "Add external pullup or pulldown resistors as needed to these signals to avoid floating inputs" Go
  • Changed PAD1000 to DLPA1000Go
  • Changed to "Establish this setting" Go
  • Changed "low a minimum" to "low to a minimum" Go
  • Changed "Should be pulled up to" to "Pull up to" Go
  • Added DMD INTERFACE pin descriptions Go
  • Added SDRAM INTERFACE pin descriptions Go
  • Changed "It should be connected" to "Connect". Go
  • Changed globally "Should be left open or unconnected for typical use." to "Leave open or unconnected for typical use." Go
  • Changed globally "An external pullup should not be applied to this pin..." to "Do not apply an external pullup to this pin..."Go
  • Changed "Unused inputs should be pulled down" to "Pull unused inputs" Go
  • Swapped all values under IOH and IOLGo
  • Changed "OHand OL" to VOH and VOL to clarify meaningGo
  • Changed "that should be applied" to "can safely be applied" Go
  • Changed "that should be applied" to "can safely be applied" Go
  • Changed "VCCIO =" to "VCCIO (V)" Go
  • Changed "MAX Supported" to "Maximum Parallel Interface" Go
  • Changed Changed "BT.565" to "BT.656" Go
  • Added link to ITU-R BT.656 specification Go
  • Changed "NOTE:" to "The table below"Go
  • Deleted "Note that"Go
  • Changed fclock minGo
  • Changed tp_clkper min and maxGo
  • Changed "should support" to "supports" Go
  • Changed "Thus, those pins should be tied" to "Tie these pins" Go
  • Changed "1.8-, 2.5-, or 3.3-V" to "1.8 V, 2.5 V, or 3.3 V" Go
  • Changed "the ASIC only supports periodic sources" to "the ASIC supports periodic sources only" Go
  • Changed "multi media" to "multimedia" Go
  • Changed Device Functional Modes to System Functional Modes and moved to correct position Go
  • Added Reference to TSTPT_6 for Crystal nominal frequencyGo
  • Changed "ASIC, and the PLL_REFCLK_O pins hould be left unconnected" to "ASIC. Leave the PLL_REFCLK_O pins unconnected" Go
  • Changed "The benefit of an oscillator is that it can be made to provide a spread-spectrum clock that reduces EMI." to "An oscillator that provides a spread-spectrum clock reduces EMI."Go
  • Changed "can only accept" to "accepts" Go
  • Added kHz Go
  • Changed several items in Table 7Go
  • Changed " the ODM’s own risk" to "the risk of the ODM" Go
  • Changed " Layout guidelines should be followed" to "Follow the layout guidelines" Go
  • Changed "To complete DLP system . . . is requiered" to "The DLP system requires"Go
  • Changed "The optical engine that has the LED packages and the DMD mounted to it is typically supplied by an optical OEM who specializes in designing optics for DLP projectors." to "An optical OEM that specializes in designing optics for DLP projectors typically supplies the optical engine that has the LED packages and the DMD mounted to it." Go
  • Deleted "Note that" Go
  • Changed "this allows these inputs to be driven high" to "This protection allows the device to drive these inputs high"Go
  • Changed Go
  • Changed "All I/O power should remain" to "Ensure that all I/O power remains" Go
  • Changed "is defined" to "operates as" Go
  • Changed "should alert" to "alerts"Go
  • Changed "Note that the reference clock should continue to run and RESET should remain" to "The reference clock continues to run. RESET remains" Go
  • Changed "At a minimum, VDD_PLL power and VSS_PLL ground pins should be isolated" to "Isolate VDD_PLL power and VSS_PLL ground pins" Go
  • Changed "It is important that the quiet ground and power are treated like analog signals" to "The ground and power domains are analog signals, and should be treated as such to achieve minimum noise."Go
  • Changed "The power and ground traces should be as short as possible" to "Ensure that the power and ground traces are as short as possible"Go
  • Changed "and should not be expected" to "so do not expect them" Go
  • Changed "they should be" to "ensure they are" Go
  • Changed "should be split" to "Split the" Go
  • Changed "In addition, the SPICLK trace . . . should be" to "Make the SPICLK trace"Go
  • Changed "should be split" to "Split the" Go
  • Changed "In addition, the SPIDOUT trace . . . should be" to "Make the SPIDOUT trace"Go
  • Changed "The SPIDIN .... should be split" to "Make the SPDIN" Go
  • Changed "on their way back" to "on the return" Go
  • Changed "They should then share" to "Make sure they share" Go
  • Changed "Variation from these recommendations may also work, but should be confirmed with PCB signal integrity analysis or lab measurements" to "Make sure to confirm any variation from these recommendations with PCB signal integrity analysis or lab measurements" Go
  • Changed PCB Design table to itemized list Go
  • Changed "should take" to "takes" Go
  • Changed "should take" to "takes" Go
  • Changed "should" to "must" Go
  • Changed "The pair should also be terminated" to "Terminate the pair" Go
  • Changed "Specifically ... should be terminated" to "Terminate" Go
  • Changed "Specifically ... should be terminated" to "Terminate" Go
  • Changed "kept" to "maintained to a length of" Go
  • Changed "should" to "does" Go

Changes from C Revision (November 2015) to D Revision

  • Removed table 'Compatible SPI Serial Flash Devices' from Serial Flash Interface since listed devices are end of life. Replaced with new suggested devices as well as Table 4 which lists minimum performance specifications to determine flash device compatibilityGo
  • Added MSL Peak Temp to Packaging InformationGo

Changes from B Revision (January 2014) to C Revision

  • Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from A Revision (December 2013) to B Revision

  • Removed product preview bannerGo

Changes from * Revision (December 2013) to A Revision