DLPS143B July   2018  – October 2020 DLPC3434

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Test Pins and General Control
    2. 5.2 Parallel Port Input
    3. 5.3 DSI Input Data and Clock
    4. 5.4 DMD Reset and Bias Control
    5. 5.5 DMD Sub-LVDS Interface
    6. 5.6 Peripheral Interface
    7. 5.7 GPIO Peripheral Interface
    8. 5.8 Clock and PLL Support
    9. 5.9 Power and Ground
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillator Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 Flash Interface Timing Requirements
    15. 6.15 Other Timing Requirements
    16. 6.16 DMD Sub-LVDS Interface Switching Characteristics
    17. 6.17 DMD Parking Switching Characteristics
    18. 6.18 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 Parallel Interface Data Transfer Format
        3. 7.3.1.3 3D Display
      2. 7.3.2 Device Startup
      3. 7.3.3 SPI Flash
        1. 7.3.3.1 SPI Flash Interface
        2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
        1. 7.3.9.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast Park Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PLL Power Layout
      2. 10.1.2 Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3 Unused Pins
      4. 10.1.4 DMD Control and Sub-LVDS Signals
      5. 10.1.5 Layer Changes
      6. 10.1.6 Stubs
      7. 10.1.7 Terminations
      8. 10.1.8 Routing Vias
      9. 10.1.9 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

5.7 GPIO Peripheral Interface

PIN(1)I/OTYPE(3)DESCRIPTION(2)
NAMENO.
GPIO_19M15I/O1General purpose I/O 19 (hysteresis buffer). Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_18M14I/O1General purpose I/O 18 (hysteresis buffer). FPGA_RESETZ (Output): Logic reset for the chipset FPGA.
GPIO_17L15I/O1General purpose I/O 17 (hysteresis buffer). ACT_SYNC (output): Output to FPGA, used for synchronizing the actuator position with the controller data processing.
GPIO_16L14I/O1General purpose I/O 16 (hysteresis buffer). Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_15K15I/O1General purpose I/O 15 (hysteresis buffer). SUB_FRAME (input): Input from FPGA, indicating when the FPGA initialization process is complete.
GPIO_14K14I/O1General purpose I/O 14 (hysteresis buffer). FPGA_RDY (input): Input from FPGA, indicating when the FPGA initialization process is complete.
GPIO_13J15I/O1General purpose I/O 13 (hysteresis buffer). Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_12J14I/O1General purpose I/O 12 (hysteresis buffer). Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_11H15I/O1General purpose I/O 11 (hysteresis buffer). Options:
  1. Thermistor power enable (output). Turns on the power to the thermistor when it is used and enabled.
  2. Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_10H14I/O1General purpose I/O 10 (hysteresis buffer). Options:
  1. RC_CHARGE (output): Intended to feed the RC charge circuit of the thermistor interface.
  2. Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_09G15I/O1General purpose I/O 09 (hysteresis buffer). Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_08G14I/O1General purpose I/O 08 (hysteresis buffer). Normal mirror parking request (active low): To be driven by the PROJ_ON output of the host. A logic low on this signal causes the DLPC3434 to PARK the DMD, but it does not power down the DMD (the DLPAxxxx does that instead). At power-up, GPIO_08 must remain high until HOST_IRQ goes low (see Section 9.3).
GPIO_07F15I/O1General purpose I/O 07 (hysteresis buffer). If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_06F14I/O1General purpose I/O 06 (hysteresis buffer). Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_05E15I/O1General purpose I/O 05 (hysteresis buffer). Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_04E14I/O1General purpose I/O 04 (hysteresis buffer). Options:
  1. 3D glasses control (output): Controls the shutters on 3D glasses (Left = 1, Right = 0).
  2. SPI1_CSZ1 (active-low output): Optional SPI1 chip select 1 signal. Requires an external pullup resistor to deactivate this signal during reset and auto-initialization processes.
  3. Optional GPIO. If unused, TI recommends this pin be configured as a logic zero GPIO output and left unconnected. Otherwise this pin requires an external pullup or pulldown to avoid a floating GPIO input.
GPIO_03D15I/O1General purpose I/O 03 (hysteresis buffer). SPI1_CSZ0 (active low output): SPI1 chip select 0 signal. This pin is typically connected to the DLPAxxxx SPI_CSZ pin. Requires an external pullup resistor to deactivate this signal during reset and auto-initialization processes.
GPIO_02D14I/O1General purpose I/O 02 (hysteresis buffer). SPI1_DOUT (output): SPI1 data output signal. This pin is typically connected to the DLPAxxxx SPI_DIN pin.
GPIO_01C15I/O1General purpose I/O 01 (hysteresis buffer). SPI1_CLK (output): SPI1 clock signal. This pin is typically connected to the DLPAxxxx SPI_CLK pin.
GPIO_00C14I/O1General purpose I/O 00 (hysteresis buffer). SPI1_DIN (input): SPI1 data input signal. This pin is typically connected to the DLPAxxxx SPI_DOUT pin.
(1) GPIO pins must be configured through software for input, output, bidirectional, or open-drain operation. Some GPIO pins have one or more alternative use modes, which are also software configurable. An external pullup resistor is required for each signal configured as open-drain.
(2) General purpose I/O for the DLPC3434 controllers. These GPIO pins are software configurable.
(3) See Table 5-1 for type definitions.