|Line 1:||DLP® Device Name: DLPC343x = x indicates a 0 or 5 device name ID.
SC: Solder ball composition
e1: Indicates lead-free solder balls consisting of SnAgCu
G8: Indicates lead-free solder balls consisting of tin-silver-copper (SnAgCu) with silver content
less than or equal to 1.5% and that the mold compound meets TI's definition of green.
|Line 2:||TI Part Number
DLP® Device Name: DLPC343x = x indicates a 0 or 5 device name ID.
R corresponds to the TI device revision letter for example A, B, or C.
XXX corresponds to the device package designator.
|Line 3:||XXXXXXXXXX-TT Manufacturer Part Number|
|Line 4:||LLLLLLLL.ZZZ Foundry lot code for semiconductor wafers and lead-free solder ball marking
LLLLLLLL: Fab lot number
ZZZ: Lot split number
|Line 5:||AA YYWW: Package assembly information
AA corresponds to the manufacturing site
YYWW: Date code (YY = Year :: WW = Week)