DLPS038E July   2014  – August 2019 DLPC3430 , DLPC3435

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Typical, Simplified System
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions – Test Pins and General Control
    2.     Pin Functions – Parallel Port Input
    3.     Pin Functions – DSI Input Data and Clock
    4.     Pin Functions – DMD Reset and Bias Control
    5.     Pin Functions – DMD Sub-LVDS Interface
    6.     Pin Functions – Peripheral Interface
    7.     Pin Functions – GPIO Peripheral Interface
    8.     Pin Functions – Clock and PLL Support
    9.     Pin Functions – Power and Ground
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillator Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 BT656 Interface General Timing Requirements
    15. 6.15 DSI Host Timing Requirements
    16. 6.16 Flash Interface Timing Requirements
    17. 6.17 Other Timing Requirements
    18. 6.18 DMD Sub-LVDS Interface Switching Characteristics
    19. 6.19 DMD Parking Switching Characteristics
    20. 6.20 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 3D Display
        3. 7.3.1.3 Parallel Interface
          1. 7.3.1.3.1 PDATA Bus – Parallel Interface Bit Mapping Modes
        4. 7.3.1.4 DSI Interface
      2. 7.3.2 Device Startup
      3. 7.3.3 SPI Flash
        1. 7.3.3.1 SPI Flash Interface
        2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
        1. 7.3.9.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast Park Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  PLL Power Layout
      2. 10.1.2  Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3  DSI Interface Layout
      4. 10.1.4  Unused Pins
      5. 10.1.5  DMD Control and Sub-LVDS Signals
      6. 10.1.6  Layer Changes
      7. 10.1.7  Stubs
      8. 10.1.8  Terminations
      9. 10.1.9  Routing Vias
      10. 10.1.10 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

DSI Host Timing Requirements

These timing requirements describe specific host minimum values that are higher than those specified in the MIPI standards. It is critical for proper operation that the host meet these minimum timing requirements for specified MIPI parameters. The decoded DSI data must also follow all Parallel Interface Frame Timing Requirements.
MIN MAX UNIT
Clock lane Frequency 80 235 MHz
Data lane Effective data rate 160 470 Mbps
Number of data lanes Selectable 1 4 Lanes
tHS-PREPARE+ tHS-ZERO During a LP to HS transition, the time that the transmitter drives the HS-0 state prior to transmitting the synchronization sequence 80 MHz to 94 MHz HS Clock 565 ns
95 MHz to 235 MHz HS Clock(1) 465(2) ns
tHS-SETTLE Time interval during which the HS receiver ignores any data lane HS transitions, starting from the beginning of THS-PREPARE; the HS receiver ignores any data lane transitions before the minimum value, and responds to any data lane transitions after the maximum value 80 MHz to 94 MHz HS Clock 565(3) ns
95 MHz to 235 MHz HS Clock 465(3) ns
Example: At 172 MHz and tHS-PREPARE = 51.46 ns → 51.46 ns + tHS-ZERO ≥ 465 ns. Therefore tHS-ZERO≥= 413.54 ns.
Minimum values are higher than those required by the MIPI standard. tHS-PREPARE must be within the MIPI specified range.
Maximum values are higher than those required by the MIPI standard.