DLPS038E July   2014  – August 2019 DLPC3430 , DLPC3435

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Typical, Simplified System
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions – Test Pins and General Control
    2.     Pin Functions – Parallel Port Input
    3.     Pin Functions – DSI Input Data and Clock
    4.     Pin Functions – DMD Reset and Bias Control
    5.     Pin Functions – DMD Sub-LVDS Interface
    6.     Pin Functions – Peripheral Interface
    7.     Pin Functions – GPIO Peripheral Interface
    8.     Pin Functions – Clock and PLL Support
    9.     Pin Functions – Power and Ground
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
    9. 6.9  DMD Low-Speed Interface Electrical Characteristics
    10. 6.10 System Oscillator Timing Requirements
    11. 6.11 Power Supply and Reset Timing Requirements
    12. 6.12 Parallel Interface Frame Timing Requirements
    13. 6.13 Parallel Interface General Timing Requirements
    14. 6.14 BT656 Interface General Timing Requirements
    15. 6.15 DSI Host Timing Requirements
    16. 6.16 Flash Interface Timing Requirements
    17. 6.17 Other Timing Requirements
    18. 6.18 DMD Sub-LVDS Interface Switching Characteristics
    19. 6.19 DMD Parking Switching Characteristics
    20. 6.20 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Source Requirements
        1. 7.3.1.1 Supported Resolution and Frame Rates
        2. 7.3.1.2 3D Display
        3. 7.3.1.3 Parallel Interface
          1. 7.3.1.3.1 PDATA Bus – Parallel Interface Bit Mapping Modes
        4. 7.3.1.4 DSI Interface
      2. 7.3.2 Device Startup
      3. 7.3.3 SPI Flash
        1. 7.3.3.1 SPI Flash Interface
        2. 7.3.3.2 SPI Flash Programming
      4. 7.3.4 I2C Interface
      5. 7.3.5 Content Adaptive Illumination Control (CAIC)
      6. 7.3.6 Local Area Brightness Boost (LABB)
      7. 7.3.7 3D Glasses Operation
      8. 7.3.8 Test Point Support
      9. 7.3.9 DMD Interface
        1. 7.3.9.1 Sub-LVDS (HS) Interface
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 PLL Design Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 Power-Up Initialization Sequence
    4. 9.4 DMD Fast Park Control (PARKZ)
    5. 9.5 Hot Plug I/O Usage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  PLL Power Layout
      2. 10.1.2  Reference Clock Layout
        1. 10.1.2.1 Recommended Crystal Oscillator Configuration
      3. 10.1.3  DSI Interface Layout
      4. 10.1.4  Unused Pins
      5. 10.1.5  DMD Control and Sub-LVDS Signals
      6. 10.1.6  Layer Changes
      7. 10.1.7  Stubs
      8. 10.1.8  Terminations
      9. 10.1.9  Routing Vias
      10. 10.1.10 Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Video Timing Parameter Definitions
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

System Power-Up and Power-Down Sequence

Although the DLPC34xx controller requires an array of power supply voltage pins (for example, VDD, VDDLP12, VDD_PLLM/D, VCC18, VCC_FLSH, and VCC_INTF), if VDDLP12 is tied to the 1.1-V VDD supply (which is assumed to be the typical configuration), then there are no restrictions regarding the relative order of power supply sequencing to avoid damaging the DLPC34xx controller (this remains true for both power-up and power-down scenarios). The controller requires no minimum delay time between powering-up and powering-down the individual supplies if the VDDLP12 is tied to the 1.1-V VDD supply.

However, if the VDDLP12 pin is not tied to the VDD supply, then the VDDLP12 pin must be powered-on only after the VDD supply is powered-on. And in a similar sequence, the VDDLP12 pin must be powered-off before the VDD supply is powered-off. If the VDDLP12 pin is not tied to VDD, then the VDDLP12 pin and VDD supply pins must be powered-on or powered-off within 100 ms of each other.

Although there is no risk of damaging the DLPC34xx controller when the above power sequencing rules are followed, these additional power sequencing recommendations must be considered to ensure proper system operation:

  • To ensure that the DLPC34xx controller output signal states behave as expected, all controller I/O supplies are encouraged to remain applied while VDD core power is applied. If VDD core power is removed while the I/O supply (VCC_INTF) is applied, then the output signal states associated with the inactive I/O supply go to a high impedance state.
  • Because additional power sequencing rules may exist for devices that share the supplies with the DLPC34xx controller (such as the PMIC and DMD), these devices may force additional system power sequencing requirements.

Figure 29, Figure 30, and Figure 31 show the DLPC34xx power-up sequence, the normal PARK power-down sequence, and the fast PARK power-down sequence of a typical DLPC34xx system.

When the VDD core power is applied, but I/O power is not applied, the controller may draw additional leakage current. This leakage current does not affect the normal DLPC34xx controller operation or reliability.

NOTE

During a Normal Park it is recommended to maintain SYSPWR within specification for at least 50 ms after PROJ_ON goes low. This is to allow the DMD to be parked and the power supply rails to safely power down. After 50 ms SYSPWR can be turned off. If a DLPA200x is used, it is also recommended that the 1.8-V supply fed into the DLPA200x load switch be maintained within specification for at least 50 ms after PROJ_ON goes low.

DLPC3430 DLPC3435 tim_startup_dlps000.gif

T0:

SYSPWR applied to the PMIC. All other voltage rails are derived from SYSPWR.

T1:

All supplies reach 95% of their specified nominal value. Note HOST_IRQ may go high sooner if it is pulled-up to a different external supply.

T2:

Point where RESETZ is deasserted (goes high). This indicates the beginning of the controller auto-initialization routine.

T3:

HOST_IRQ goes low to indicate initialization is complete.

(A):

VDDLP12 must be powered on after VDD if it is supplied from a separate source.

(B):

PLL_REFCLK is allowed to be active before power is applied.

(C):

PLL_REFCLK must be stable within 5 ms of all power being applied. For external oscillator applications this is oscillator dependent, and for crystal applications this is crystal and controller oscillator cell dependent.

(D) :

PARKZ must be high before RESETZ releases to support auto-initialization. RESETZ must also be held low for at least 5 ms after the power supplies are in specification.

(E):

I2C activity cannot start until HOST_IRQ goes low to indicate auto-initialization completes.
Figure 29. System Power-Up Waveforms (with DLPA3000)
DLPC3430 DLPC3435 tim_normal_park_dlps000.gif

T1:

PROJ_ON goes low to begin the power down sequence.

T2:

The controller finishes parking the DMD.

T3:

RESETZ is asserted which causes HOST_IRQ to be pulled high.

T4:

All controller power supplies are turned off.

T5:

SYSPWR is removed now that all other supplies are turned off.

(A):

I2C activity must stop before PROJ_ON is deasserted (goes low).

(B):

The DMD will be parked within 20 ms of PROJ_ON being deasserted (going low). VDD, VDD_PLLM/D, VCC18, VCC_INITF, and VCC_FLSH power supplies and the PLL_REFCLK must be held within specification for a minimum of 20 ms after PROJ_ON is deasserted (goes low). However, 20 ms does not satisfy the typical shutdown timing of the entire chipset. It is therefore recommended to follow note (c).

(C):

It is recommended that SYSPWR not be turned off for 50 ms after PROJ_ON is deasserted (goes low). This time allows the DMD to be parked, the controller to turn off, and the PMIC supplies to shut down.
Figure 30. Normal Park Power-Down Waveforms
DLPC3430 DLPC3435 tim_fast_park_dlps000.gif

T1:

A fault is detected (in this example the PMIC detects a UVLO condition) and PARKZ is asserted (goes low) to tell the controller to initiate a fast park of the DMD.

T2:

The controller finishes the fast park procedure.

T3:

RESETZ is asserted which puts the controller in a reset state which causes HOST_IRQ to be pulled high.

T4:

Eventually all power supplies that were derived from SYSPWR collapse.

(A):

VDD, VDD_PLLM/D, VCC18, VCC_INITF, and VCC_FLSH power supplies and the PLL_REFCLK must be held within specification for a minimum of 32 µs after PARKZ is asserted (goes low).

(B):

VCC18 must remain in specification long enough to satisfy DMD power sequencing requirements defined in the DMD datasheet. Also see the DLPAxxxx datasheets for more information.
Figure 31. Fast Park Power-Down Waveforms