6.4 Thermal Information
||Junction-to-case top thermal resistance
||Junction-to-air thermal resistance
||at 0 m/s of forced airflow(2)
|at 1 m/s of forced airflow(2)
|at 2 m/s of forced airflow(2)
||Temperature variance from junction to package top center temperature, per unit power dissipation(3)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics
application report, SPRA953
(2) Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal resistance of the package as measured using a JEDEC defined standard test PCB. This JEDEC test PCB is not necessarily representative of the DLPC34xx PCB and thus the reported thermal resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best information available during the design phase to estimate thermal performance.
(3) Example: (0.5 W) × (0.2 °C/W) ≈ 0.1°C temperature rise.