DLPS117B July   2018  – October 2020 DLPC6421

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Oscillators Timing Requirements
    7. 6.7  Test and Reset Timing Requirements
    8. 6.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 6.9  Port 1 Input Pixel Timing Requirements
    10. 6.10 DMD LVDS Interface Timing Requirements
    11. 6.11 Synchronous Serial Port (SSP) Interface Timing Requirements
    12. 6.12 Programmable Output Clocks Switching Characteristics
    13. 6.13 Synchronous Serial Port Interface (SSP) Switching Characteristics
    14. 6.14 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 System Reset Operation
        1. 7.2.1.1 Power-up Reset Operation
        2. 7.2.1.2 System Reset Operation
      2. 7.2.2 Spread Spectrum Clock Generator Support
      3. 7.2.3 GPIO Interface
      4. 7.2.4 Source Input Blanking
      5. 7.2.5 Video Graphics Processing Delay
      6. 7.2.6 Program Memory Flash
      7. 7.2.7 Calibration and Debug Support
      8. 7.2.8 Board Level Test Support
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 General Handling Guidelines for Unused CMOS-type Pins
  9. Power Supply Recommendations
    1. 9.1 System Power Regulations
    2. 9.2 System Power-Up Sequence
    3. 9.3 Power-On Sense (POSENSE) Support
    4. 9.4 System Environment and Defaults
      1. 9.4.1 DLPC6421 System Power-Up and Reset Default Conditions
      2. 9.4.2 1.1-V System Power
      3. 9.4.3 1.8-V System Power
      4. 9.4.4 3.3-V System Power
      5. 9.4.5 Power Good (PWRGOOD) Support
      6. 9.4.6 I2C BUSY (I2C_BUSY)
      7. 9.4.7 5V Tolerant Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Guidelines for Internal DLPC6421 Power
      2. 10.1.2 DMD Interface Considerations
      3. 10.1.3 Layout Example
      4. 10.1.4 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Video Timing Parameter Definitions
      2. 11.1.2 Device Markings
        1. 11.1.2.1 Device Marking Description
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Program Memory Flash

The DLPC6421 controller provides an external program memory chip select:

  • PM_CSZ_1 – dedicated CS for boot flash device (i.e. Standard NOR-type flash, ≤ 128 Mb)

The DLPC6421 controller provides enough Program Memory Address pins to support a flash device up to 128 Mb. The two most significant address bits (i.e. PM_ADDR_22 and PM_ADDR_21) are shared on pins GPIO_36 and GPIO_35 respectively. Like other GPIO pins, these pins float in a high-impedance input state following reset; therefore, if these GPIO pins are to be reconfigured as Program Memory Address pins, they require board-level pull-down resistors to prevent any flash address bits from floating until software is able to reconfigure the pins from GPIO to Program Memory Address. Also note that until software reconfigures the pins from GPIO to Program Memory Address, upper portions of flash memory are not accessible.

Table 7-2 shows typical GPIO_35 and GPIO36 pin configuration for various flash sizes.

Table 7-2 Typical GPIO_35 and GPIO_36 Pin Configurations for Various Flash Sizes
FLASH SIZEGPIO_36 Pin ConfigurationGPIO_35 Pin Configuration
32 Mb or lessPM_ADDR_22(1)PM_ADDR_21(1)
64 Mb
128 Mb
Board-level pulldown resistor required.