DLPS117B July   2018  – October 2020 DLPC6421

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Oscillators Timing Requirements
    7. 6.7  Test and Reset Timing Requirements
    8. 6.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 6.9  Port 1 Input Pixel Timing Requirements
    10. 6.10 DMD LVDS Interface Timing Requirements
    11. 6.11 Synchronous Serial Port (SSP) Interface Timing Requirements
    12. 6.12 Programmable Output Clocks Switching Characteristics
    13. 6.13 Synchronous Serial Port Interface (SSP) Switching Characteristics
    14. 6.14 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 System Reset Operation
        1. 7.2.1.1 Power-up Reset Operation
        2. 7.2.1.2 System Reset Operation
      2. 7.2.2 Spread Spectrum Clock Generator Support
      3. 7.2.3 GPIO Interface
      4. 7.2.4 Source Input Blanking
      5. 7.2.5 Video Graphics Processing Delay
      6. 7.2.6 Program Memory Flash
      7. 7.2.7 Calibration and Debug Support
      8. 7.2.8 Board Level Test Support
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 General Handling Guidelines for Unused CMOS-type Pins
  9. Power Supply Recommendations
    1. 9.1 System Power Regulations
    2. 9.2 System Power-Up Sequence
    3. 9.3 Power-On Sense (POSENSE) Support
    4. 9.4 System Environment and Defaults
      1. 9.4.1 DLPC6421 System Power-Up and Reset Default Conditions
      2. 9.4.2 1.1-V System Power
      3. 9.4.3 1.8-V System Power
      4. 9.4.4 3.3-V System Power
      5. 9.4.5 Power Good (PWRGOOD) Support
      6. 9.4.6 I2C BUSY (I2C_BUSY)
      7. 9.4.7 5V Tolerant Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Guidelines for Internal DLPC6421 Power
      2. 10.1.2 DMD Interface Considerations
      3. 10.1.3 Layout Example
      4. 10.1.4 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Video Timing Parameter Definitions
      2. 11.1.2 Device Markings
        1. 11.1.2.1 Device Marking Description
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

General Handling Guidelines for Unused CMOS-type Pins

To avoid potentially damaging current caused by floating CMOS input-only pins, it is recommended that unused ASIC input pins be tied through a pull-up resistor to its associated power supply or a pull-down to ground. For DLPC6421 inputs with an internal pull-up or pull-down resistors, it is unnecessary to add an external pull-up/ pull down unless specifically recommended. Note that internal pull-up & pull-down resistors are weak and should not be expected to drive the external line.

Unused output-only pins can be left open. When possible, it is recommended that unused Bi-directional I/O pins be configured to their output state such that the pin can be left open. If this control is not available and the pins may become an input, then they should be pulled-up (or down) using an appropriate resistor