DLPS117B July   2018  – October 2020 DLPC6421

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Oscillators Timing Requirements
    7. 6.7  Test and Reset Timing Requirements
    8. 6.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 6.9  Port 1 Input Pixel Timing Requirements
    10. 6.10 DMD LVDS Interface Timing Requirements
    11. 6.11 Synchronous Serial Port (SSP) Interface Timing Requirements
    12. 6.12 Programmable Output Clocks Switching Characteristics
    13. 6.13 Synchronous Serial Port Interface (SSP) Switching Characteristics
    14. 6.14 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 System Reset Operation
        1. 7.2.1.1 Power-up Reset Operation
        2. 7.2.1.2 System Reset Operation
      2. 7.2.2 Spread Spectrum Clock Generator Support
      3. 7.2.3 GPIO Interface
      4. 7.2.4 Source Input Blanking
      5. 7.2.5 Video Graphics Processing Delay
      6. 7.2.6 Program Memory Flash
      7. 7.2.7 Calibration and Debug Support
      8. 7.2.8 Board Level Test Support
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 General Handling Guidelines for Unused CMOS-type Pins
  9. Power Supply Recommendations
    1. 9.1 System Power Regulations
    2. 9.2 System Power-Up Sequence
    3. 9.3 Power-On Sense (POSENSE) Support
    4. 9.4 System Environment and Defaults
      1. 9.4.1 DLPC6421 System Power-Up and Reset Default Conditions
      2. 9.4.2 1.1-V System Power
      3. 9.4.3 1.8-V System Power
      4. 9.4.4 3.3-V System Power
      5. 9.4.5 Power Good (PWRGOOD) Support
      6. 9.4.6 I2C BUSY (I2C_BUSY)
      7. 9.4.7 5V Tolerant Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Guidelines for Internal DLPC6421 Power
      2. 10.1.2 DMD Interface Considerations
      3. 10.1.3 Layout Example
      4. 10.1.4 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Video Timing Parameter Definitions
      2. 11.1.2 Device Markings
        1. 11.1.2.1 Device Marking Description
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

PCB Layout Guidelines for Internal DLPC6421 Power

TI recommends the following guidelines to achieve desired DLPC6421 performance relative to internal PLLs:

  • The DLPC6421 device contains four PLL pins (PLLM1, PLLM2, PLLD , and PLLS), each of which have a dedicated 1.1-V digital supply, and three of which (PLLM1, PLLM2, and PLLD) have a dedicated 1.8-V analog supply. It is important to filter the supply pins that cover a broad frequency range. Use a ferrite bead and a 0.1-µF ceramic capacitor to create the filter for each 1.1-V PLL supply pin . Place these components very close to the individual PLL supply balls. Ensure that the impedance of the ferrite bead is much greater than that of the capacitor at frequencies above 10 MHz. Ensure that the 1.1-V to the PLL supply pins have a low-frequency RC filter. This low-frequency filter can be common to all the PLLs. The controller limits the voltage drop across the resistor by the 1.1-V regulator tolerance and the controller voltage tolerance. A resistance of 0.36 Ω and a 100 µF ceramic are recommended.
  • Use a similar filter topology fro the analog 1.8-V PLL power pins. Use a dedicated linear regulator to generate the 1.8-V power.
  • When designing the overall supply filter network, ensure that no resonance occurs especially when operating in the 1-MHz to 2-MHz frequency band, as this coincides with the PLL natural loop frequency.

GUID-A13826FB-75F4-4B45-B9EA-60E854AD45F5-low.gifFigure 10-1 PLL Filter Layout

High frequency decoupling is required for both 1.1-V and 1.8-V PLL supplies and should be provided as close as possible to each of the PLL supply package pins. TI recommends placing decoupling capacitors under the package on the opposite side of the board. Use high quality, low-ESR, monolithic, surface mount capacitors. Typically 0.1µF for each PLL supply should be sufficient. The length of a connecting trace increases the parasitic inductance of the mounting and thus, where possible, there should be no trace, allowing the via to butt up against the land itself. Additionally, the connecting trace should be made as wide as possible. Further improvement can be made by placing vias to the side of the capacitor lands or doubling the number of vias.

The location of bulk decoupling depends on the system design.