SNLS638B December   2018  – January 2025 DP83825I

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     DP83825I Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Auto-Negotiation (Speed / Duplex Selection)
      2. 6.3.2  Auto-MDIX Resolution
      3. 6.3.3  Energy Efficient Ethernet
        1. 6.3.3.1 EEE Overview
        2. 6.3.3.2 EEE Negotiation
      4. 6.3.4  EEE for Legacy MACs Not Supporting 802.3az
      5. 6.3.5  Wake-on-LAN Packet Detection
        1. 6.3.5.1 Magic Packet Structure
        2. 6.3.5.2 Magic Packet Example
        3. 6.3.5.3 Wake-on-LAN Configuration and Status
      6. 6.3.6  Low Power Modes
        1. 6.3.6.1 Active Sleep
      7. 6.3.7  IEEE Power Down
      8. 6.3.8  Deep Power Down
      9. 6.3.9  Reduced Media Independent Interface (RMII)
      10. 6.3.10 RMII Repeater Mode
      11. 6.3.11 Serial Management Interface
        1. 6.3.11.1 Extended Register Space Access
        2. 6.3.11.2 Read Operation
        3. 6.3.11.3 Write Operation
      12. 6.3.12 100BASE-TX
        1. 6.3.12.1 100BASE-TX Transmitter
          1. 6.3.12.1.1 Code-Group Encoding and Injection
          2. 6.3.12.1.2 Scrambler
          3. 6.3.12.1.3 NRZ to NRZI Encoder
          4. 6.3.12.1.4 Binary to MLT-3 Converter
        2. 6.3.12.2 100BASE-TX Receiver
      13. 6.3.13 10BASE-Te
        1. 6.3.13.1 Squelch
        2. 6.3.13.2 Normal Link Pulse Detection and Generation
        3. 6.3.13.3 Jabber
        4. 6.3.13.4 Active Link Polarity Detection and Correction
      14. 6.3.14 Loopback Modes
        1. 6.3.14.1 MII Loopback
        2. 6.3.14.2 PCS Loopback
        3. 6.3.14.3 Digital Loopback
        4. 6.3.14.4 Analog Loopback
        5. 6.3.14.5 Reverse Loopback
      15. 6.3.15 BIST Configurations
      16. 6.3.16 Cable Diagnostics
        1. 6.3.16.1 TDR
        2. 6.3.16.2 Fast Link-Drop Functionality
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 Straps Configuration
        1. 6.5.1.1 Straps for PHY Address
    6. 6.6 Device Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Clock Requirements
          1. 7.2.1.1.1 Oscillator
          2. 7.2.1.1.2 Crystal
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 RMII Layout Guidelines
        2. 7.2.2.2 MDI Layout Guidelines
        3. 7.2.2.3 TPI Network Circuit
        4. 7.2.2.4 VOD Configuration
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Signal Traces
        2. 7.4.1.2 Return Path
        3. 7.4.1.3 Transformer Layout
          1. 7.4.1.3.1 Transformer Recommendations
        4. 7.4.1.4 Capacitive DC Blocking
        5. 7.4.1.5 Metal Pour
        6. 7.4.1.6 PCB Layer Stacking
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision A (August 2019) to Revision B (January 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed the amount of time to hold RST_N in Pin Functions TableGo
  • Changed Power Supply sequencing to say VDDIO before AVDD under Power-Up Timing (T2)Go
  • Added 0ms as minimum time for T2 under Power-up TimingGo
  • RMII Master/Slave changed to RMII Transmit/Receive to better reflect the timing diagramsGo
  • Added how long to hold down reset in case of unstable clockGo
  • Changed Figure 6-2 and Figure 6-3 Go
  • Changed extended register access section for clarityGo
  • Changed Table 6-5, Table 6-6 and Table 6-7 to move write to address 0x001F as the last stepGo
  • Flipped the bit values in register 0x17 (bits 2 and 3) and 0x4D1 (bits 0 and 3)Go
  • Added VOD Configuration sectionGo
  • Added Capacitive Blocking sectionGo

Changes from Revision * (December 2018) to Revision A (August 2019)

  • Changed device status from: Advanced Information to: Production Data Go