SNLS603C December   2020  – November 2022 DP83TG720R-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
    2. 6.1 Pin States
    3. 6.2 Pin Power Domain
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 LED Drive Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Diagnostic Tool Kit
        1. 8.3.1.1 Signal Quality Indicator
        2. 8.3.1.2 Time Domain Reflectometry
        3. 8.3.1.3 Built-In Self-Test For Datapath
          1. 8.3.1.3.1 Loopback Modes
          2. 8.3.1.3.2 Data Generator
          3. 8.3.1.3.3 Programming Datapath BIST
        4. 8.3.1.4 Temperature and Voltage Sensing
        5. 8.3.1.5 Electrostatic Discharge Sensing
      2. 8.3.2 Compliance Test Modes
        1. 8.3.2.1 Test Mode 1
        2. 8.3.2.2 Test Mode 2
        3. 8.3.2.3 Test Mode 4
        4. 8.3.2.4 Test Mode 5
        5. 8.3.2.5 Test Mode 6
        6. 8.3.2.6 Test Mode 7
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Down
      2. 8.4.2  Reset
      3. 8.4.3  Standby
      4. 8.4.4  Normal
      5. 8.4.5  Sleep
      6. 8.4.6  State Transitions
        1. 8.4.6.1 State Transition #1 - Standby to Normal
        2. 8.4.6.2 State Transition #2 - Normal to Standby
        3. 8.4.6.3 State Transition #3 - Normal to Sleep
        4. 8.4.6.4 State Transition #4 - Sleep to Normal
      7. 8.4.7  Media Dependent Interface
        1. 8.4.7.1 MDI Master and MDI Slave Configuration
        2. 8.4.7.2 Auto-Polarity Detection and Correction
      8. 8.4.8  MAC Interfaces
        1. 8.4.8.1 Reduced Gigabit Media Independent Interface
      9. 8.4.9  Serial Management Interface
      10. 8.4.10 Direct Register Access
      11. 8.4.11 Extended Register Space Access
      12. 8.4.12 Write Address Operation
        1. 8.4.12.1 Example - Write Address Operation
      13. 8.4.13 Read Address Operation
        1. 8.4.13.1 Example - Read Address Operation
      14. 8.4.14 Write Operation (No Post Increment)
        1. 8.4.14.1 Example - Write Operation (No Post Increment)
      15. 8.4.15 Read Operation (No Post Increment)
        1. 8.4.15.1 Example - Read Operation (No Post Increment)
      16. 8.4.16 Write Operation (Post Increment)
        1. 8.4.16.1 Example - Write Operation (Post Increment)
      17. 8.4.17 Read Operation (Post Increment)
        1. 8.4.17.1 Example - Read Operation (Post Increment)
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Register Access Summary
      2. 8.6.2 DP83TG720 Registers
        1. 8.6.2.1 Base Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Compatibility with TI's 100BT1 PHY
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Signal Traces
      2. 12.1.2 Return Path
      3. 12.1.3 Physical Medium Attachment
      4. 12.1.4 Metal Pour
      5. 12.1.5 PCB Layer Stacking
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
      1. 14.1.1 Packaging Information
      2. 14.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Functions

Table 6-1 Pin Functions
PINSTATE(1)DESCRIPTION (2)
NAMENO.
MAC INTERFACE

RX_D3

23S, PD, O

Receive Data: Symbols received on the cable are decoded and transmitted out of these pins synchronous to the rising edge of RX_CLK. They contain valid data when RX_DV(decoded from RX_CTL) is asserted. A nibble, RX_D[3:0], is transmitted in RGMII mode.

RX_D2

24

RX_D1

25

RX_D0

26
RX_CLK27O

Receive Clock: In RGMII mode, PHY provides this 125-MHz clock to MAC.

RX_CTRL15S, PD, O

RGMII Receive Control: Receive control combines receive data valid indication and receive error indication into a single signal. RX_DV is presented on the rising edge of RX_CLK and RX_ER is presented on the falling edge of RX_CLK.

TX_CLK28I

Transmit Clock: In RGMII mode, MAC provides this 125-MHz clock to PHY.

TX_CTRL29I

RGMII Transmit Control: Transmit control combines transmit enable and transmit error indication into a single signal. TX_EN is presented prior to the rising edge of TX_CLK; TX_ER is presented on the falling edge of TX_CLK.

TX_D330I

Transmit Data: In RGMII mode, the transmit data nibble, TX_D[3:0], is received from the MAC .

TX_D231

TX_D1

32

TX_D0

33
SERIAL MANAGEMENT INTERFACE
MDC1I

Management Data Clock: Synchronous clock to the MDIO serial management input and output data.

MDIO36OD, IO

Management Data Input/Output: Bidirectional management data signal that may be sourced by the management station or the PHY. This pin requires an external pull-up resistor (recommended value = 2.2-kΩ) .

CONTROL INTERFACE
INT2PU, OD, O

Interrupt: Active-LOW output, which will be asserted LOW when an interrupt condition occurs. This pin has a weak internal pullup. Register access is necessary to enable various interrupt triggers. Once an interrupt event flag is set, register access is required to clear the interrupt event on this pin.

This pin can be configured as an Active-HIGH output using register[0x0011].

To capture the interrupt source reliably, status from interrupt registers x12, x13, x18 is recommended to be read after interrupt is asserted on int_n pin.

RESET3PU, I

RESET: Active-LOW input, which initializes or reinitializes the DP83TG720R-Q1. Asserting this pin LOW for at least 10 μs will force a reset process to occur. All internal registers will reinitialize to their default states as specified for each bit in the Register Map section. All bootstrap pins are resampled upon deassertion of reset.

INH10PMOS OD

INH: Active-HIGH PMOS open-drain output. When the PHY enters the sleep state, PHY will release the INH pin to allow an external pull-down resistor (recommended value = 10 kΩ) to pull the line to ground. When in any other state, the INH pin will drive a HIGH state to the VSLEEP rail.

WAKE8PD, I

WAKE: Active-HIGH (this pin works on VSLEEP domain) pulse on wake-up pin wakes up the PHY from the sleep state. For pulse width, refer to timing section. This pin can be directly tied to the VSLEEP rail when the sleep state is not used or left float.

STRP_114I

Strap 1: This pin is for strapping PHY_AD bits.

CLOCK INTERFACE
XI5I

Reference Clock Input: Reference clock 25-MHz ±100 ppm-tolerance crystal or oscillator input. The device supports either an external crystal resonator connected across pins XI and XO, or an external CMOS-level oscillator connected to pin XI only and XO left floating.

XO4O

Reference Clock Output: XO pin is used for crystal only. This pin should be left floating when a CMOS-level oscillator is connected to XI.

LED/GPIO INTERFACE
LED_0 / GPIO_035S, PD, IO

LED_0: Link Status

LED_1 / GPIO_16S, PD, IO

LED_1: Link Status and BLINK for TX/RX Activity

CLKOUT / GPIO_216IO

Clock Output: 25-MHz reference clock(buffered replication of XI) by default. If not used, clock output can be disabled by writing register 0x0453 = 0x0006.

MEDIUM DEPENDENT INTERFACE
TRD_M13IO

Differential Transmit and Receive: Bidirectional differential signaling configured for 1000BASE-T1 operation, IEEE 802.3bp compliant.

TRD_P12
POWER AND GROUND CONNECTIONS
VDDA3P311SUPPLY

Core Supply: 3.3 V. Refer to power supply recommendations for decoupling network.

VDDIO22, 34SUPPLY

IO Supply: 1.8 V, 2.5 V, or 3.3 V. Refer to power supply recommendations for decoupling network.

VDD1P09, 21SUPPLY

Core Supply: 1.0 V. Refer to power supply recommendations for decoupling network.

VSLEEP7SUPPLY

Sleep Supply: 3.3 V. Refer to power supply recommendations for decoupling network.

This pin shall be tied to VDDA3P3 if sleep functionality is not used.

GROUNDDAPGROUND

Ground

DO NOT CONNECT
DNC17, 18, 19, 20DNC

DNC: Do Not Connect (test structures connected to these pins and should be kept floating to avoid damage or wrong mode entry of PHY)

Type: I = Input
O = Output
IO = Input/Output
OD = Open Drain
PD = Internal Pulldown
PU = Internal Pullup
S = Strap: Configuration pin (all configuration pins have weak internal pullups or pulldowns)
When pins are unused, follow the recommended connection requirements provided in the table above. If pins do not have required termination, they may be left floating.