SPRSP35J February   2019  – August 2021 DRA829J , DRA829V

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1. 6.3.1  ADC
        1. 6.3.1.1 MCU Domain
      2. 6.3.2  DDRSS
        1. 6.3.2.1 MAIN Domain
      3. 6.3.3  GPIO
        1. 6.3.3.1 MAIN Domain
        2. 6.3.3.2 WKUP Domain
      4. 6.3.4  I2C
        1. 6.3.4.1 MAIN Domain
        2. 6.3.4.2 MCU Domain
        3. 6.3.4.3 WKUP Domain
      5. 6.3.5  I3C
        1. 6.3.5.1 MAIN Domain
        2. 6.3.5.2 MCU Domain
      6. 6.3.6  MCAN
        1. 6.3.6.1 MAIN Domain
        2. 6.3.6.2 MCU Domain
      7. 6.3.7  MCSPI
        1. 6.3.7.1 MAIN Domain
        2. 6.3.7.2 MCU Domain
      8. 6.3.8  UART
        1. 6.3.8.1 MAIN Domain
        2. 6.3.8.2 MCU Domain
        3. 6.3.8.3 WKUP Domain
      9. 6.3.9  MDIO
        1. 6.3.9.1 MCU Domain
      10. 6.3.10 CPSW2G
        1. 6.3.10.1 MCU Domain
      11. 6.3.11 CPSW9G
        1. 6.3.11.1 MAIN Domain
      12. 6.3.12 ECAP
        1. 6.3.12.1 MAIN Domain
      13. 6.3.13 EQEP
        1. 6.3.13.1 MAIN Domain
      14. 6.3.14 EHRPWM
        1. 6.3.14.1 MAIN Domain
      15. 6.3.15 USB
        1. 6.3.15.1 MAIN Domain
      16. 6.3.16 SERDES
        1. 6.3.16.1 MAIN Domain
      17. 6.3.17 OSPI
        1. 6.3.17.1 MCU Domain
      18. 6.3.18 Hyperbus
        1. 6.3.18.1 MCU Domain
      19. 6.3.19 GPMC
        1. 6.3.19.1 MAIN Domain
      20. 6.3.20 MMC
        1. 6.3.20.1 MAIN Domain
      21. 6.3.21 CPTS
        1. 6.3.21.1 MCU Domain
        2. 6.3.21.2 MAIN Domain
      22. 6.3.22 UFS
        1. 6.3.22.1 MAIN Domain
      23. 6.3.23 PRU_ICSSG [Currently Not Supported]
        1. 6.3.23.1 MAIN Domain
      24. 6.3.24 MCASP
        1. 6.3.24.1 MAIN Domain
      25. 6.3.25 DSS
        1. 6.3.25.1 MAIN Domain
      26. 6.3.26 DP
        1. 6.3.26.1 MAIN Domain
      27. 6.3.27 Camera Streaming Interface Receiver (CSI_RX_IF) Subsystem
        1. 6.3.27.1 MAIN Domain
      28. 6.3.28 DSI_TX
        1. 6.3.28.1 MAIN Domain
      29. 6.3.29 VPFE
        1. 6.3.29.1 MAIN Domain
      30. 6.3.30 DMTIMER
        1. 6.3.30.1 MAIN Domain
        2. 6.3.30.2 MCU Domain
      31. 6.3.31 Emulation and Debug
        1. 6.3.31.1 MAIN Domain
      32. 6.3.32 System and Miscellaneous
        1. 6.3.32.1 Boot Mode Configuration
          1. 6.3.32.1.1 MAIN Domain
          2. 6.3.32.1.2 MCU Domain
        2. 6.3.32.2 Clock
          1. 6.3.32.2.1 MAIN Domain
          2. 6.3.32.2.2 WKUP Domain
        3. 6.3.32.3 System
          1. 6.3.32.3.1 MAIN Domain
          2. 6.3.32.3.2 WKUP Domain
        4. 6.3.32.4 EFUSE
      33. 6.3.33 Power Supply
    4. 6.4 Pin Multiplexing
    5. 6.5 Connections for Unused Pins
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On-Hour (POH) Limits
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
      1. 7.7.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.7.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 7.7.3  HFOSC/LFOSC Electrical Characteristics
      4. 7.7.4  eMMCPHY Electrical Characteristics
      5. 7.7.5  SDIO Electrical Characteristics
      6. 7.7.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 7.7.7  ADC12B Electrical Characteristics
      8. 7.7.8  MLB LVCMOS Electrical Characteristics
      9. 7.7.9  LVCMOS Electrical Characteristics
      10. 7.7.10 USB2PHY Electrical Characteristics
      11. 7.7.11 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      12. 7.7.12 UFS M-PHY Electrical Characteristics
      13. 7.7.13 eDP/DP AUX-PHY Electrical Characteristics
      14. 7.7.14 DDR0 Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics for ALF Package
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Sequencing
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Combined MCU and Main Domains Power-Up Sequencing
        3. 7.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 7.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 7.10.2.5 Isolated MCU and Main Domains, Primary Power- Down Sequencing
        6. 7.10.2.6 Entry and Exit of MCU Only State
        7. 7.10.2.7 Entry and Exit of DDR Retention State
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input and Output Clocks / Oscillators
          1. 7.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 7.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 7.10.4.1.3.1 Load Capacitance
            2. 7.10.4.1.3.2 Shunt Capacitance
          4. 7.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 7.10.4.1.5 Auxiliary OSC1 Not Used
          6. 7.10.4.1.6 WKUP_LFOSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.6.1 WKUP_LFOSC0 Not Used
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Module and Peripheral Clocks Frequencies
      5. 7.10.5 Peripherals
        1. 7.10.5.1  ATL
          1. 7.10.5.1.1 ATL_PCLK Timing Requirements
          2. 7.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 7.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 7.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 7.10.5.2  VPFE
        3. 7.10.5.3  CPSW2G
          1. 7.10.5.3.1 CPSW2G MDIO Interface Timings
          2. 7.10.5.3.2 CPSW2G RMII Timings
            1. 7.10.5.3.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.3.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.3.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 7.10.5.3.3 CPSW2G RGMII Timings
            1. 7.10.5.3.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.3.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.10.5.3.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.3.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        4. 7.10.5.4  CPSW9G
          1. 7.10.5.4.1 CPSW9G MDIO Interface Timings
          2. 7.10.5.4.2 CPSW9G RMII Timings
            1. 7.10.5.4.2.1 RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.4.2.2 RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.4.2.3 RMII[x]_TXD[1:0], and RMII[x]_TXEN Switching Characteristics – RMII Mode
          3. 7.10.5.4.3 CPSW9G RGMII Timings
            1. 7.10.5.4.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.4.3.2 RGMII[x]_RD[3:0] and RGMII[x]_RCTL Timing Requirements – RGMII Mode
            3. 7.10.5.4.3.3 RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.4.3.4 RGMII[x]_TD[3:0] and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        5. 7.10.5.5  CSI-2
        6. 7.10.5.6  DDRSS
        7. 7.10.5.7  DSS
        8. 7.10.5.8  eCAP
          1. 7.10.5.8.1 Timing Requirements for eCAP
          2. 7.10.5.8.2 Switching Characteristics for eCAP
        9. 7.10.5.9  EPWM
          1. 7.10.5.9.1 Timing Requirements for eHRPWM
          2. 7.10.5.9.2 Switching Characteristics for eHRPWM
        10. 7.10.5.10 eQEP
          1. 7.10.5.10.1 Timing Requirements for eQEP
          2. 7.10.5.10.2 Switching Characteristics for eQEP
        11. 7.10.5.11 GPIO
          1. 7.10.5.11.1 GPIO Timing Requirements
          2. 7.10.5.11.2 GPIO Switching Characteristics
        12. 7.10.5.12 GPMC
          1. 7.10.5.12.1 GPMC and NOR Flash — Synchronous Mode
            1. 7.10.5.12.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 7.10.5.12.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 7.10.5.12.2 GPMC and NOR Flash — Asynchronous Mode
            1. 7.10.5.12.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.12.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 7.10.5.12.3 GPMC and NAND Flash — Asynchronous Mode
            1. 7.10.5.12.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.12.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 7.10.5.12.4 GPMC0 IOSET
        13. 7.10.5.13 HyperBus
          1. 7.10.5.13.1 Timing Requirements for HyperBus
          2. 7.10.5.13.2 HyperBus 166 MHz Switching Characteristics
          3. 7.10.5.13.3 HyperBus 100 MHz Switching Characteristics
        14. 7.10.5.14 I2C
        15. 7.10.5.15 I3C
        16. 7.10.5.16 MCAN
        17. 7.10.5.17 MCASP
        18. 7.10.5.18 MCSPI
          1. 7.10.5.18.1 MCSPI — Master Mode
          2. 7.10.5.18.2 MCSPI — Slave Mode
        19. 7.10.5.19 MMCSD
          1. 7.10.5.19.1 MMC0 - eMMC Interface
            1. 7.10.5.19.1.1 Legacy SDR Mode
            2. 7.10.5.19.1.2 High Speed SDR Mode
            3. 7.10.5.19.1.3 High Speed DDR Mode
            4. 7.10.5.19.1.4 HS200 Mode
          2. 7.10.5.19.2 MMC1/2 - SD/SDIO Interface
            1. 7.10.5.19.2.1 Default Speed Mode
            2. 7.10.5.19.2.2 High Speed Mode
            3. 7.10.5.19.2.3 UHS–I SDR12 Mode
            4. 7.10.5.19.2.4 UHS–I SDR25 Mode
            5. 7.10.5.19.2.5 UHS–I SDR50 Mode
            6. 7.10.5.19.2.6 UHS–I DDR50 Mode
            7. 7.10.5.19.2.7 UHS–I SDR104 Mode
        20. 7.10.5.20 CPTS
          1. 7.10.5.20.1 CPTS Timing Requirements
          2. 7.10.5.20.2 CPTS Switching Characteristics
        21. 7.10.5.21 OSPI
          1. 7.10.5.21.1 OSPI With Data Training
            1. 7.10.5.21.1.1 OSPI Switching Characteristics – Data Training
          2. 7.10.5.21.2 OSPI Without Data Training
            1. 7.10.5.21.2.1 OSPI Timing Requirements – SDR Mode
            2. 7.10.5.21.2.2 OSPI Switching Characteristics – SDR Mode
            3. 7.10.5.21.2.3 OSPI Timing Requirements – DDR Mode
            4. 7.10.5.21.2.4 OSPI Switching Characteristics – DDR Mode
        22. 7.10.5.22 OLDI
          1. 7.10.5.22.1 OLDI Switching Characteristics
        23. 7.10.5.23 PCIE
        24. 7.10.5.24 Timers
          1. 7.10.5.24.1 Timing Requirements for Timers
          2. 7.10.5.24.2 Switching Characteristics for Timers
        25. 7.10.5.25 UART
          1. 7.10.5.25.1 Timing Requirements for UART
          2. 7.10.5.25.2 UART Switching Characteristics
        26. 7.10.5.26 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
          1. 7.10.6.2.1 JTAG Electrical Data and Timing
            1. 7.10.6.2.1.1 JTAG Timing Requirements
            2. 7.10.6.2.1.2 JTAG Switching Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A72
      2. 8.2.2 Arm Cortex-R5F
      3. 8.2.3 DSP C71x
      4. 8.2.4 DSP C66x
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 GPU
      2. 8.3.2 D5520MP2
      3. 8.3.3 VXE384MP2
    4. 8.4 Other Subsystems
      1. 8.4.1 MSMC
      2. 8.4.2 NAVSS
        1. 8.4.2.1 NAVSS0
        2. 8.4.2.2 MCU_NAVSS
      3. 8.4.3 PDMA Controller
      4. 8.4.4 Power Supply
      5. 8.4.5 Peripherals
        1. 8.4.5.1  ADC
        2. 8.4.5.2  ATL
        3. 8.4.5.3  CSI
          1. 8.4.5.3.1 Camera Streaming Interface Receiver (CSI_RX_IF) and MIPI DPHY Receiver (DPHY_RX)
          2. 8.4.5.3.2 Camera Streaming Interface Transmitter (CSI_TX_IF)
        4. 8.4.5.4  CPSW2G
        5. 8.4.5.5  CPSW9G
        6. 8.4.5.6  DCC
        7. 8.4.5.7  DDRSS
        8. 8.4.5.8  DSS
          1. 8.4.5.8.1 DSI
          2. 8.4.5.8.2 eDP
        9. 8.4.5.9  VPFE
        10. 8.4.5.10 eCAP
        11. 8.4.5.11 EPWM
        12. 8.4.5.12 ELM
        13. 8.4.5.13 ESM
        14. 8.4.5.14 eQEP
        15. 8.4.5.15 GPIO
        16. 8.4.5.16 GPMC
        17. 8.4.5.17 Hyperbus
        18. 8.4.5.18 I2C
        19. 8.4.5.19 I3C
        20. 8.4.5.20 MCAN
        21. 8.4.5.21 MCASP
        22. 8.4.5.22 MCRC Controller
        23. 8.4.5.23 MCSPI
        24. 8.4.5.24 MMC/SD
        25. 8.4.5.25 OSPI
        26. 8.4.5.26 PCIE
        27. 8.4.5.27 SerDes
        28. 8.4.5.28 WWDT
        29. 8.4.5.29 Timers
        30. 8.4.5.30 UART
        31. 8.4.5.31 USB
        32. 8.4.5.32 UFS
  9. 9 Applications and Implementation
    1. 9.1 Power Supply Mapping
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
        1. 9.2.1.1 Power Distribution Network Implementation Guidance
      2. 9.2.2 External Oscillator
      3. 9.2.3 JTAG and EMU
      4. 9.2.4 Reset
      5. 9.2.5 Unused Pins
      6. 9.2.6 Hardware Design Guide for JacintoTM 7 Devices
    3. 9.3 Peripheral- and Interface-Specific Design Information
      1. 9.3.1 LPDDR4 Board Design and Layout Guidelines
      2. 9.3.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 9.3.2.1 No Loopback and Internal Pad Loopback
        2. 9.3.2.2 External Board Loopback
        3. 9.3.2.3 DQS (only available in Octal Flash devices)
      3. 9.3.3 SERDES REFCLK Design Guidelines
      4. 9.3.4 USB VBUS Design Guidelines
      5. 9.3.5 System Power Supply Monitor Design Guidelines
      6. 9.3.6 High Speed Differential Signal Routing Guidance
      7. 9.3.7 Thermal Solution Guidance
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALF|827
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from July 22, 2021 to August 27, 2021 (from Revision I (July 2021) to Revision J (August 2021))

  • Global:: Deleted "DMIPS" referencesGo
  • (Device Comparison): Deleted "MCU Island with Lockstep Arm Cortex-R5Fs" row, as info in Lockstep and Safety Targeted rows. Go
  • (Pin Attributes): Updated Buffer Type for MCU_PORz and PORz to FS Reset.Go
  • Updated USB0/1_RCALIB footnote to specify the pin must be connected to VSS through an external resistor, even when the pin is unusedGo
  • Updated REXT pin note to show it should always be connected through an external resistor to VSS, even when unusedGo
  • Added clarification notes to MMC1_SDCD and MMC2_SDCD signals about pulled down requirementGo
  • Updated CSI0/1_RXRCALIB footnote to specify the pin must be connected to VSS through an external resistor, even when the pin is unusedGo
  • Updated DSI_TXRCALIB footnote to specify the pin must be connected to VSS through an external resistor, even when the pin is unusedGo
  • Showed SERDES[4:0]_REXT balls should be connected to VSS if unused in Connections for Unused Pins.Go
  • Showed VMON balls should be connected to PWR if unused in Connections for Unused Pins. Also added note specifying MMC1_SDCD and MMC2_SDCD should be pulled down to function properly Go
  • Showed CSI[1:0]_RXRCALIB, DSI_TXRCALIB, USB[1:0]_RCALIB pins should be connected to VSS is unused in Connections for Unused Pins Go
  • Removed preliminary note under Specifications Go
  • Added FS Reset Electrical Characteristics tableGo
  • (SERDES Electrical Characteristics): Added SERDES REFCLK electrical characteristics table. The limits are only applicable when internal termination is enabledGo
  • (GPMC and NOR Flash — Sync Burst Read — 4x16–bit): Updated figure for GPMC_WAIT[j] signal (F21, F22)Go
  • (GPMC and Multiplexed NOR Flash — Sync Burst Write): Updated figure for GPMC_WAIT[j] signal (F21, F22)Go
  • (McSPI): Updated output load limit for SPI_CLK.Go
  • (Timing and Switching Characteristics): Updated MMC1, MMC2 SDR12, SDR25, SDR50, SDR104 switching characteristics parameters to show data is launched off of rising edgeGo
  • (OSPI Switching Characteristics Table - Data Training): Updated cycle time for CLK to 6 ns (1.8 V) from 6.02 ns and 7.5 ns (3.3 V) from 7.52 ns for both SDR and DDR.Go
  • (OSPI Switching Characteristics - No Data Training SDR Mode ): Updated 3.3 V cycle time to 7.5 ns from 7.52 ns.Go

Changes from July 19, 2021 to July 21, 2021 (from Revision H (July 2021) to Revision I (July 2021))

  • (Nomenclature Description): Added device type "P" and "R"Go

Changes from April 1, 2021 to July 19, 2021 (from Revision G (April 2021) to Revision H (July 2021))

  • (Features): Added statement to clarify device security and safety/ASIL are on select part number variantsGo
  • (Device Comparison): Updated MSMC capacity for DRA829JM to 8MB. Updated Note 7 under Device Comparison table to be generic. Added rows and footnotes clarifying certain safety and security feature are available on select part number variantsGo
  • (Related Products): Updated link and description to Software Development KitGo
  • (Pin Attributes): Added the secondary pin multiplexing functions for the SERDES and controlled by CTRLMMR regsGo
  • (Signal Descriptions): Added note to clarify CPTS signal connectionGo
  • (Signal Descriptions): Moved MCU CPTS signals from CPSW2G to CPTS section. Moved SYNCn_OUT signals from SYSTEM to CPTS section. Updated both sets of signal descriptions.Go
  • Updated description for VDDA_ADC0/1 to reference internal tie to VREFPGo
  • Added note specifying power balls must be supplied with voltage specified in Recommended Operating Condition. Go
  • (Pin Multiplexing): Updated PADCONFIG register address column to show actual address value and not address offset valueGo
  • (Abs Max Ratings): Added Latch-Up Performance parameter valuesGo
  • Updated VDDS_DDR voltage rails min limits to 1.06 V in alignment with JEDEC spec. Updated description for VDD_CPU AVS range. Go
  • (MLB Electrical Characteristics table): Updated IOL/IOH=6 mA; VILSS=0.3*VDDIO; VIH=0.75*VDDIO. Added slew rate informationGo
  • (Electrical Characteristics tables): Updated eMMC PHY VILSS, VIHSS, VOL, VOH, IOL, IOH limits. Go
  • (Electrical Characteristics tables): Update ADC leakage for VSS to show negative currentGo
  • (Electrical Characteristics tables): Removed HFOSC/LFOSC leakage current parameter. Removed I2C slew rate parameter. Removed SDIO and LVCMOS slew rate. Go
  • (Electrical Characteristics tables): Added Section headers to all electrical characteristics tables.Go
  • (ROC for OTP eFuse Programming): Removed leakage current parameter for VPP_CORE and VPP_MCUGo
  • Updated Power Supply Sequencing SectionGo
  • (Input and Output Clocks / Oscillators):Updated "Input Clocks Interface" imageGo
  • (WKUP_OSC0 Crystal Electrical Characteristics): Updated/Changed Cshunt, ESRxtal = 80 Ω from "24MHz" to now "25 MHz"Go
  • (OSC1 Crystal Electrical Characteristics): Updated/Changed Cshunt, ESRxtal = 80 Ω from "24MHz" to now "25 MHz"Go
  • Added WKUP_LFOSC0 startup time limiGo
  • (Device Module Clock Frequencies): Renamed title and added references to TRM/DM sections describing module clock and frequencies.Go
  • (ATCLK[x] Switching Characteristics): Updated/Changed table information and associated ATCLK[x] Timing figure.Go
  • Updated CSI-2 max freq supportGo
  • (GPMC): Added IOSET information for GPMC0 signalsGo
  • (I3C): Updated parameter names from "D#" to "OD#" and updated images new names and corected/deleted some timings.Go
  • (McASP Timing Conditions): Updated td(Trace Delay) parameter limitsGo
  • (McSPI): Added IOSET information for MCU_SPI0 and MCU_SPI1.Go
  • (MMC1/2 - SD/SDIO Interface): Added UHS-I SDR104 support as well as corresponding Timing Switching CharacteristicsGo
  • Added note clarifying I/O timing is not applicable when OSPI is used with data training Go
  • (OSPI DDR Timing): Removed internal loopback and internal pad loopback mode limits from OSPI timing tablesGo
  • (Detailed Description): Added power supply description and described how common power supply types can be grouped.Go
  • (External Oscillator): Added reference to Clock Specifications section.Go
  • (20210706): Updated Reset section descriptionGo
  • (LPDDR4 Board Design and Layout Guidelines): Updated ulink and title to be Jacinto 7 LPDDR guidelinesGo
  • (Device and Documentation Support): Added missing Electrostatic Discharge Caution sectionGo
  • (Nomenclature Description): Removed XJ721EGALF from Note 4 to make the statement genericGo