SPRSP35J February 2019 – August 2021 DRA829J , DRA829V
Refer to the PDF data sheet for device specific package drawings
The Thermal Design Guide for DSP and ARM Application Processors provides guidance for successful implementation of a thermal solution for system designs containing this device. This document provides background information on common terms and methods related to thermal solutions. TI only supports designs that follow system design guidelines contained in the application report.