SLOS751D March 2013 – November 2018 DRV2667
Use the following guidelines for the DRV2667 device layout:
Use of the thermal footprint outlined by this datasheet is recommended to achieve optimum device performance. See land pattern diagram for exact dimensions.
The DRV2667 device power pad must be soldered directly to the thermal pad on the printed circuit board. The printed circuit board thermal pad must be connected to the ground net and thermal vias to any existing backside/internal copper ground planes. Connection to a ground plane on the top layer near the corners of the device is also recommended. Another key layout consideration is to keep the boost programming resistors (R1 and R2) as close as possible to the FB pin of the device. Care must be taken to avoid getting the FB trace near the SW trace.