SLASF54 January   2023 DRV2901

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Block Diagrams
    2. 7.2 Feature Description
      1. 7.2.1 Error Reporting
      2. 7.2.2 Device Reset
      3. 7.2.3 Device Protection System
        1. 7.2.3.1 Overcurrent (OC) Protection With Current Limiting and Overload Detection
        2. 7.2.3.2 Overtemperature Protection
        3. 7.2.3.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
  9. 9 Power Supply Recommendations
    1. 9.1 System Power-up/power-down Sequence
      1. 9.1.1 Powering Up
      2. 9.1.2 Powering Down
    2. 9.2 System Design Recommendations
      1. 9.2.1 VDD Pin
      2. 9.2.2 VREG Pin
      3. 9.2.3 OTW Pin
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)DRV2901UNIT
DDV 44-PINS HTSSOP
JEDEC STANDARD 4 LAYER PCB
RθJAJunction-to-ambient thermal resistance50.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance0.36°C/W
RθJBJunction-to-board thermal resistance24.4°C/W
ψJTJunction-to-top characterization parameter0.19°C/W
ψJBJunction-to-board characterization parameter24.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.