SLVSEE3B November   2017  – October 2019 DRV3245Q-Q1


  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Device Nomenclature
    2. 5.2 Documentation Support
    3. 5.3 Receiving Notification of Documentation Updates
    4. 5.4 Community Resources
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 Glossary
  6. 6Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.