SLIS162H December   2014  – August 2018 DRV5013-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Output State
      2.      Device Packages
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Magnetic Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Field Direction Definition
      2. 7.3.2 Device Output
      3. 7.3.3 Power-On Time
      4. 7.3.4 Output Stage
      5. 7.3.5 Protection Circuits
      6. 7.3.6 Overcurrent Protection (OCP)
      7. 7.3.7 Load Dump Protection
      8. 7.3.8 Reverse Supply Protection
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Standard Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuration Example
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Two-Wire Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from G Revision (October 2017) to H Revision

  • Changed Power Supply Recommendations section Go

Changes from F Revision (September 2016) to G Revision

  • Changed location of automotive-specific Features bullets to top of Features section Go
  • Added device HBM and CDM classification sub-bullets to automotive-specific Features bullet Go
  • Added last sentence to Device Functional Modes section Go

Changes from E Revision (August 2016) to F Revision

Changes from D Revision (June 2016) to E Revision

  • Revised preliminary limits for FA version in the Magnetic Characteristics tableGo
  • Added the Layout sectionGo

Changes from C Revision (May 2016) to D Revision

  • Revised preliminary limits for the FA versionGo

Changes from B Revision (February 2016) to C Revision

  • Revised preliminary limits for the FA version Go

Changes from A Revision (December 2015) to B Revision

  • Added the FA device optionGo
  • Added the typical bandwidth value to the Magnetic Characteristics tableGo

Changes from * Revision (December 2014) to A Revision

  • Corrected body size of SOT-23 package and SIP package name to TO-92 Go
  • Added BMAX to Absolute Maximum RatingsGo
  • Removed table notes regarding testing for the operating junction temperature in Absolute Maximum RatingsGo
  • Updated package tape and reel options for M and blank Go
  • Added Community ResourcesGo