SLVSG22A january 2023 – june 2023 DRV8145-Q1
PRODUCTION DATA
Refer Transient thermal impedance table for application related use case.
THERMAL METRIC(1) | HTSSOP package | VQFN-HR package | UNIT | |
---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance | 27.7 | 41.3 | °C/W |
RθJC(top) | Junction-to-case(top) thermal resistance | 13.8 | 14.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 7.1 | 5.5 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.6 | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 7.1 | 5.4 | °C/W |
RθJC(bot) | Junction-to-case(bottom) thermal resistance | 0.9 | N/A | °C/W |