SLVSG22B January   2023  – March 2024 DRV8145-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
    1. 5.1 HW Variant
      1. 5.1.1 VQFN-HR(16) package
    2. 5.2 SPI Variant
      1. 5.2.1 HTSSOP (28) package
      2. 5.2.2 VQFN-HR(16) package
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
      1. 6.5.1  Power Supply & Initialization
      2. 6.5.2  Logic I/Os
      3. 6.5.3  SPI I/Os
      4. 6.5.4  Configuration Pins - HW Variant Only
      5. 6.5.5  Power FET Parameters
      6. 6.5.6  Switching Parameters with High-Side Recirculation
      7. 6.5.7  Switching Parameters with Low-Side Recirculation
      8. 6.5.8  IPROPI & ITRIP Regulation
      9. 6.5.9  Over Current Protection (OCP)
      10. 6.5.10 Over Temperature Protection (TSD)
      11. 6.5.11 Voltage Monitoring
      12. 6.5.12 Load Monitoring
      13. 6.5.13 Fault Retry Setting
      14. 6.5.14 Transient Thermal Impedance & Current Capability
    6. 6.6 SPI Timing Requirements
    7. 6.7 Switching Waveforms
      1. 6.7.1 Output switching transients
        1. 6.7.1.1 High-Side Recirculation
        2. 6.7.1.2 Low-Side Recirculation
      2. 6.7.2 Wake-up Transients
        1. 6.7.2.1 HW Variant
        2. 6.7.2.2 SPI Variant
      3. 6.7.3 Fault Reaction Transients
        1. 6.7.3.1 Retry setting
        2. 6.7.3.2 Latch setting
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 HW Variant
      2. 7.2.2 SPI Variant
    3. 7.3 Feature Description
      1. 7.3.1 External Components
        1. 7.3.1.1 HW Variant
        2. 7.3.1.2 SPI Variant
      2. 7.3.2 Bridge Control
        1. 7.3.2.1 Register - Pin Control - SPI Variant Only
      3. 7.3.3 Device Configuration
        1. 7.3.3.1 Slew Rate (SR)
        2. 7.3.3.2 IPROPI
        3. 7.3.3.3 ITRIP Regulation
        4. 7.3.3.4 DIAG
          1. 7.3.3.4.1 HW variant
          2. 7.3.3.4.2 SPI variant
      4. 7.3.4 Protection and Diagnostics
        1. 7.3.4.1 Over Current Protection (OCP)
        2. 7.3.4.2 Over Temperature Protection (TSD)
        3. 7.3.4.3 Off-State Diagnostics (OLP)
        4. 7.3.4.4 On-State Diagnostics (OLA) - SPI Variant Only
        5. 7.3.4.5 VM Over Voltage Monitor
        6. 7.3.4.6 VM Under Voltage Monitor
        7. 7.3.4.7 Charge pump under voltage monitor
        8. 7.3.4.8 Power On Reset (POR)
        9. 7.3.4.9 Event Priority
    4. 7.4 Programming - SPI Variant Only
      1. 7.4.1 SPI Interface
      2. 7.4.2 Standard Frame
      3. 7.4.3 SPI Interface for Multiple Peripherals
        1. 7.4.3.1 Daisy Chain Frame for Multiple Peripherals
  9. Register Map - SPI Variant Only
    1. 8.1 User Registers
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Load Summary
    2. 9.2 Typical Application
      1. 9.2.1 HW Variant
      2. 9.2.2 SPI Variant
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Bulk Capacitance Sizing
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Overview

The DRV814x-Q1 family of devices are brushed DC motor drivers that operate from 4.5 to 35-V supporting a wide range of output load currents for various types of motors and loads. The devices integrate a charge pump regulator to support efficient high-side N-channel MOSFETs with 100% duty cycle operation. The devices operate from a single power supply input (VM) which can be directly connected to a battery or DC voltage supply. The devices also provide a low power mode to minimize current draw during system inactivity.

The devices are available in two interface variants -

  1. HW variant - Hardwired interface variant is available for easy device configuration. Due to the limited number of available pins in the device, this variant offers fewer configuration and fault reporting capability compared to the SPI variant.
  2. SPI variant - A standard 4-wire serial peripheral interface (SPI) with daisy chain capability allows flexible device configuration and detailed fault reporting to an external controller. The feature differences of the SPI and HW variants can be found in the device comparison section. The SPI interface is available in two device variant choices, as stated below:
    1. SPI (S) variant - The power supply for the digital block is provided by an internal LDO regulator sourced from VM supply. The nSLEEP pin is a high impedance input pin.
    2. SPI (P) variant (N/A for DRV8144-Q1) - This allows for an external supply input to the digital block of the device through a VDD pin. The nSLEEP pin is replaced by this VDD supply pin. This prevents device reset (brown out) during a VM under voltage condition.

The DRV814x family of devices provide a load current sense output using current mirrors on the high-side power MOSFETs. The IPROPI pin sources a small current that is proportional to the current in the high-side MOSFETs (current sourced out of the OUTx pin). This current can be converted to a proportional voltage using an external resistor (RIPROPI). Additionally, the devices also support a fixed off-time PWM chopping scheme for limiting current to the load. The current regulation level can be configured through the ITRIP function.

A variety of protection features and diagnostic functions are integrated into the device. These include supply voltage monitors (VMOV & VMUV), charge pump undervoltage (CPUV), off-state (Passive) diagnostics (OLP), on-state (Active) diagnostics (OLA) - SPI variant only, overcurrent protection (OCP) for each power FET and over-temperature shutdown (TSD). Fault conditions are indicated on the nFAULT pin. The SPI variant has additional communication protection features such as frame errors and lock features for configuration register bits and driver control bits.