SLVSFF3C December   2021  – October 2022 DRV8328

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specification
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings Comm
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information 1pkg
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Three BLDC Gate Drivers
        1. 8.3.1.1 PWM Control Modes
          1. 8.3.1.1.1 6x PWM Mode
          2. 8.3.1.1.2 3x PWM Mode
        2. 8.3.1.2 Device Hardware Interface
        3. 8.3.1.3 Gate Drive Architecture
          1. 8.3.1.3.1 Propagation Delay
          2. 8.3.1.3.2 Deadtime and Cross-Conduction Prevention
      2. 8.3.2 AVDD Linear Voltage Regulator
      3. 8.3.3 Pin Diagrams
      4. 8.3.4 Gate Driver Shutdown Sequence (DRVOFF)
      5. 8.3.5 Gate Driver Protective Circuits
        1. 8.3.5.1 PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 8.3.5.2 AVDD Power on Reset (AVDD_POR)
        3. 8.3.5.3 GVDD Undervoltage Lockout (GVDD_UV)
        4. 8.3.5.4 BST Undervoltage Lockout (BST_UV)
        5. 8.3.5.5 MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 8.3.5.6 VSENSE Overcurrent Protection (SEN_OCP)
        7. 8.3.5.7 Thermal Shutdown (OTSD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Gate Driver Functional Modes
        1. 8.4.1.1 Sleep Mode
        2. 8.4.1.2 Operating Mode
        3. 8.4.1.3 Fault Reset (nSLEEP Reset Pulse)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Three Phase Brushless-DC Motor Control
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1 Motor Voltage
          2. 9.2.1.1.2 Bootstrap Capacitor and GVDD Capacitor Selection
          3. 9.2.1.1.3 Gate Drive Current
          4. 9.2.1.1.4 Gate Resistor Selection
          5. 9.2.1.1.5 System Considerations in High Power Designs
            1. 9.2.1.1.5.1 Capacitor Voltage Ratings
            2. 9.2.1.1.5.2 External Power Stage Components
            3. 9.2.1.1.5.3 Parallel MOSFET Configuration
          6. 9.2.1.1.6 Dead Time Resistor Selection
          7. 9.2.1.1.7 VDSLVL Selection
          8. 9.2.1.1.8 AVDD Power Losses
          9. 9.2.1.1.9 Power Dissipation and Junction Temperature Losses
      2. 9.2.2 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance Sizing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1.1 Detailed Design Procedure

Section 9.2.1.1 lists the example input parameters for the system design.

Table 9-1 Design parameters

DESIGN PARAMETERS

REFERENCE

EXAMPLE VALUE

Supply voltage

VPVDD

24 V

Motor peak current

IPEAK

20 A

PWM Frequency

fPWM

20 kHz

MOSFET VDS Slew Rate

SR

120 V/us

MOSFET input gate capacitance

QG

108 nC

MOSFET input gate capacitance

QGD

14 nC

Dead time

tdead

200 ns

Overcurrent protection

IOCP

30 A