The gate drivers implement adjustable VDS voltage monitors to detect overcurrent or short-circuit conditions on the external power MOSFETs. When the monitored voltage is greater than the VDS trip point (VVDS_OCP) for longer than the deglitch time (tOCP), an overcurrent condition is detected and action is taken according to the device VDS fault mode.
The high-side VDS monitors measure the voltage between the VDRAIN and SHx pins. In devices with three current-shunt amplifiers (DRV8353 and DRV8353R), the low-side VDS monitors measure the voltage between the SHx and SPx pins. If the current shunt amplifier is unused, tie the SP pins to the common ground point of the external half-bridges. On device options without the current shunt amplifiers (DRV8350 and DRV8350R) the low-side VDS monitor measures between the SHx and SLx pins.
For the SPI devices, the low-side VDS monitor reference point can be changed between the SPx and SNx pins if desired with the LS_REF register setting. This is only for the low-side VDS monitor. The high-side VDS monitor stays between the VDRAIN and SHx pins.
The VVDS_OCP threshold is programmable between 0.06 V and 2 V on SPI device and between 0.06 V and 1 V on hardware interface devices. Additional information on the VDS monitor levels are described in the Register Maps section for SPI devices and in the Pin Diagrams section hardware interface device.