SLVSGH7B november 2022 – july 2023 DRV8410
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | DEVICE | DEVICE | UNIT | |
---|---|---|---|---|
PWP (HTSSOP) | RTE (WQFN) | |||
PINS | PINS | |||
RθJA | Junction-to-ambient thermal resistance | 48.3 | 55 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 47.8 | 56.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 23.3 | 28.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 3.7 | 2.7 | °C/W |
ΨJB | Junction-to-board characterization parameter | 23.3 | 28.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.5 | 15.9 | °C/W |