SLVS855J July   2008  – March 2015 DRV8800 , DRV8801

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1  Logic Inputs
      2. 9.3.2  VREG (DRV8800 Only)
      3. 9.3.3  VPROPI (DRV8801 Only)
      4. 9.3.4  Charge Pump
      5. 9.3.5  Shutdown
      6. 9.3.6  Low-Power Mode
      7. 9.3.7  Braking
      8. 9.3.8  Diagnostic Output
      9. 9.3.9  Thermal Shutdown (TSD)
      10. 9.3.10 Overcurrent Protection
      11. 9.3.11 SENSE
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Operation
        1. 9.4.1.1 Slow-Decay SR (Brake Mode)
        2. 9.4.1.2 Fast Decay With Synchronous Rectification
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Motor Voltage
        2. 10.2.2.2 Power Dissipation
        3. 10.2.2.3 Motor Current Trip Point
        4. 10.2.2.4 Sense Resistor Selection
        5. 10.2.2.5 Drive Current
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Bulk Capacitance
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

  • The printed-circuit-board (PCB) should use a heavy ground plane. For optimal electrical and thermal performance, the DRV880x must be soldered directly onto the board. On the underside of the DRV880x is a thermal pad, which provides a path for enhanced thermal dissipation. The thermal pad should be soldered directly to an exposed surface on the PCB. Thermal vias are used to transfer heat to other layers of the PCB.
  • The load supply pin VBB, should be decoupled with an electrolytic capacitor (typically 100 µF) in parallel with a ceramic capacitor (0.1 µF) placed as close as possible to the device.
  • The ceramic capacitors (0.1 µF) between VCP and VBB and between CP1 and CP2 should be placed as close as possible to the device.
  • The SENSE resistor should be close as possible to the SENSE pin and ground return to minimize parasitic inductance.

12.2 Layout Example

DRV8800 DRV8801 layout_rty_slvs855.gifFigure 17. RTY Layout Example
DRV8800 DRV8801 layout_pwp_slvs855.gifFigure 18. PWP Layout Example