SLVS855J July   2008  – March 2015 DRV8800 , DRV8801

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1  Logic Inputs
      2. 9.3.2  VREG (DRV8800 Only)
      3. 9.3.3  VPROPI (DRV8801 Only)
      4. 9.3.4  Charge Pump
      5. 9.3.5  Shutdown
      6. 9.3.6  Low-Power Mode
      7. 9.3.7  Braking
      8. 9.3.8  Diagnostic Output
      9. 9.3.9  Thermal Shutdown (TSD)
      10. 9.3.10 Overcurrent Protection
      11. 9.3.11 SENSE
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Operation
        1. 9.4.1.1 Slow-Decay SR (Brake Mode)
        2. 9.4.1.2 Fast Decay With Synchronous Rectification
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Motor Voltage
        2. 10.2.2.2 Power Dissipation
        3. 10.2.2.3 Motor Current Trip Point
        4. 10.2.2.4 Sense Resistor Selection
        5. 10.2.2.5 Drive Current
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Bulk Capacitance
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from I Revision (January 2014) to J Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from H Revision (November 2013) to I Revision

  • Added IOCP to ELECTRICAL CHARACTERISTICSGo
  • Changed Figure 5Go

Changes from G Revision (October 2013) to H Revision

  • Changed maximum junction temperature from 190°C to 150°CGo
  • Changed VTRP description/test conditionsGo
  • Changed Protection Circuitry sectionGo
  • Changed Note in SENSE sectionGo