SLVSAW5D July   2011  – December 2024 DRV8803

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
    1.     Pin Functions
  7. 6 Specification
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Drivers
      2. 7.3.2 Protection Circuits
        1. 7.3.2.1 Overcurrent Protection (OCP)
        2. 7.3.2.2 Thermal Shutdown (TSD)
        3. 7.3.2.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Parallel Interface Operation
      2. 7.4.2 nENBL and RESET Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Application as Load driver
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Supply Voltage
          2. 8.1.1.2.2 Load Current
            1. 8.1.1.2.2.1 Peak Current
            2. 8.1.1.2.2.2 Hold Current
            3. 8.1.1.2.2.3 Frequency
        3. 8.1.1.3 Application Curves
      2. 8.1.2 Application as Unipolar Stepper Driver
        1. 8.1.2.1 Design Requirements
        2. 8.1.2.2 Detailed Design Procedure
          1. 8.1.2.2.1 Motor Voltage
          2. 8.1.2.2.2 Drive Current
        3. 8.1.2.3 Application Curves
    2.     Power Supply Recommendations
      1. 8.2.1 Bulk Capacitance
    3. 8.2 Layout
      1. 8.2.1 Layout Guidelines
      2. 8.2.2 Layout Example
      3. 8.2.3 Thermal Consideration
        1. 8.2.3.1 Thermal Protection
        2. 8.2.3.2 Power Dissipation
        3. 8.2.3.3 Heatsinking
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Community Resources
    3. 9.3 Trademarks
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Layout Guidelines

The bulk capacitor should be placed to minimize the distance of the high-current path through the motor driver device. The connecting metal trace widths should be as wide as possible, and numerous vias should be used when connecting PCB layers. These practices minimize inductance and allow the bulk capacitor to deliver high current.

Small-value capacitors should be ceramic, and placed closely to device pins.

The high-current device outputs should use wide metal traces.

The device thermal pad should be soldered to the PCB top-layer ground plane. Multiple vias should be used to connect to a large bottom-layer ground plane. The use of large metal planes and multiple vias help dissipate the I2 × RDS(on) heat that is generated in the device.