SLVSEE9D April   2020  – April 2021 DRV8889-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 rms Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Controlling VREF with an MCU DAC
      5. 7.3.5  Current Regulation
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
        4. 7.3.6.4 Mixed Decay for Increasing and Decreasing Current
        5. 7.3.6.5 Smart tune Dynamic Decay
        6. 7.3.6.6 Smart tune Ripple Control
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  Linear Voltage Regulators
      10. 7.3.10 Logic Level Pin Diagrams
        1. 7.3.10.1 nFAULT Pin
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
          1. 7.3.11.3.1 Latched Shutdown (OCP_MODE = 0b)
          2. 7.3.11.3.2 Automatic Retry (OCP_MODE = 1b)
        4. 7.3.11.4 Open-Load Detection (OL)
        5. 7.3.11.5 Stall Detection
        6. 7.3.11.6 Thermal Shutdown (OTSD)
          1. 7.3.11.6.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 7.3.11.6.2 Automatic Recovery (OTSD_MODE = 1b)
        7. 7.3.11.7 Overtemperature Warning (OTW)
        8. 7.3.11.8 Undertemperature Warning (UTW)
        9.       53
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Disable Mode (nSLEEP = 1, DRVOFF = 1)
      3. 7.4.3 Operating Mode (nSLEEP = 1, DRVOFF = 0)
      4. 7.4.4 nSLEEP Reset Pulse
      5.      59
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Slave Device
        3. 7.5.1.3 SPI for Multiple Slave Devices in Parallel Configuration
        4. 7.5.1.4 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
      4. 8.2.4 Thermal Application
        1. 8.2.4.1 Power Dissipation
          1. 8.2.4.1.1 Conduction Loss
          2. 8.2.4.1.2 Switching Loss
          3. 8.2.4.1.3 Power Dissipation Due to Quiescent Current
          4. 8.2.4.1.4 Total Power Dissipation
        2. 8.2.4.2 PCB Types
        3. 8.2.4.3 Thermal Parameters for HTSSOP Package
        4. 8.2.4.4 Thermal Parameters for VQFN Package
        5. 8.2.4.5 Device Junction Temperature Estimation
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.3 Microstepping Indexer

Built-in indexer logic in the device allows a number of different step modes. The MICROSTEP_MODE bits in the SPI register are used to configure the step mode as shown in Table 7-2.

Table 7-2 Microstepping Settings
MICROSTEP_MODESTEP MODE
0000bFull step (2-phase excitation) with 100% current
0001bFull step (2-phase excitation) with 71% current
0010bNon-circular 1/2 step
0011b1/2 step
0100b1/4 step
0101b1/8 step
0110b1/16 step
0111b1/32 step
1000b1/64 step
1001b1/128 step
1010b1/256 step

Table 7-3 shows the relative current and step directions for full-step (71% current), 1/2 step, 1/4 step and 1/8 step operation. Higher microstepping resolutions follow the same pattern. The AOUT current is the sine of the electrical angle and the BOUT current is the cosine of the electrical angle. Positive current is defined as current flowing from the xOUT1 pin to the xOUT2 pin while driving.

At each rising edge of the STEP input the indexer travels to the next state in the table. The direction is shown with the DIR pin logic high. If the DIR pin is logic low, the sequence is reversed.

Note:

If the step mode is changed on the fly while stepping, the indexer advances to the next valid state for the new step mode setting at the rising edge of STEP.

Note:

While DIR = 0 and the electrical angle is at a full step angle (45, 135, 225, or 315 degrees), two rising edge pulses on the STEP pin are required in order to advance the indexer after changing from any microstep mode to the full step mode. The first pulse will induce no change in the electrical angle, the second pulse will move the indexer to the next full step angle.

The home state is an electrical angle of 45°. This state is entered after power-up, after exiting logic undervoltage lockout, or after exiting sleep mode.

Table 7-3 Relative Current and Step Directions
1/8 STEP1/4 STEP1/2 STEPFULL
STEP
71%		AOUT CURRENT
(% FULL-SCALE)		BOUT CURRENT
(% FULL-SCALE)		ELECTRICAL ANGLE (DEGREES)
11101000
2209811
32389223
4568334
5321717145
6835656
74923868
8982079
953100090
1098–20101
11692–38113
1283–56124
1374271–71135
1456–83146
15838–92158
1620–98169
17950–100180
18–20–98191
1910–38–92203
20–56–83214
211163–71–71225
22–83–56236
2312–92–38248
24–98–20259
25137–1000270
26–9820281
2714–9238293
28–8356304
291584–7171315
30–5683326
3116–3892338
32–2098349

Table 7-4 shows the full step operation with 100% full-scale current. This stepping mode consumes more power than full-step mode with 71% current, but provides a higher torque at high motor RPM.

Table 7-4 Full Step with 100% Current
FULL
STEP
100%		AOUT CURRENT
(% FULL-SCALE)		BOUT CURRENT
(% FULL-SCALE)		ELECTRICAL ANGLE (DEGREES)
110010045
2100-100135
3-100-100225
4-100100315

Table 7-5 shows the noncircular 1/2–step operation. This stepping mode consumes more power than circular 1/2-step operation, but provides a higher torque at high motor RPM.

Table 7-5 Non-Circular 1/2-Stepping Current
NON-CIRCULAR 1/2-STEPAOUT CURRENT
(% FULL-SCALE)		BOUT CURRENT
(% FULL-SCALE)		ELECTRICAL ANGLE (DEGREES)
101000
210010045
3100090
4100–100135
50–100180
6–100–100225
7–1000270
8–100100315