SPRS742L June   2011  – February 2021 F28M35E20B , F28M35H22C , F28M35H52C , F28M35H52C-Q1 , F28M35M22C , F28M35M52C

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings – Automotive
    3. 7.3  ESD Ratings – Commercial
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Consumption Summary
      1. 7.5.1 Current Consumption at 150-MHz C28x SYSCLKOUT and 75-MHz M3SSCLK
      2. 7.5.2 Current Consumption at 100-MHz C28x SYSCLKOUT and 100-MHz M3SSCLK
      3. 7.5.3 Current Consumption at 75-MHz C28x SYSCLKOUT and 75-MHz M3SSCLK
      4. 7.5.4 Current Consumption at 60-MHz C28x SYSCLKOUT and 60-MHz M3SSCLK
    6. 7.6  Electrical Characteristics
    7. 7.7  Thermal Resistance Characteristics for RFP PowerPAD Package
    8. 7.8  Thermal Design Considerations
    9. 7.9  Timing and Switching Characteristics
      1. 7.9.1 Power Sequencing
        1. 7.9.1.1 Reset ( XRS) Timing Requirements
        2. 7.9.1.2 Reset ( XRS) Switching Characteristics
        3. 7.9.1.3 Power Management and Supervisory Circuit Solutions
      2. 7.9.2 Clock Specifications
        1. 7.9.2.1 Changing the Frequency of the Main PLL
        2. 7.9.2.2 Input Clock Frequency and Timing Requirements, PLL Lock Times
          1. 7.9.2.2.1 Input Clock Frequency
          2. 7.9.2.2.2 Crystal Oscillator Electrical Characteristics
          3. 7.9.2.2.3 X1 Timing Requirements - PLL Enabled (1)
          4. 7.9.2.2.4 X1 Timing Requirements - PLL Disabled
          5. 7.9.2.2.5 XCLKIN Timing Requirements - PLL Enabled
          6. 7.9.2.2.6 XCLKIN Timing Requirements - PLL Disabled
          7. 7.9.2.2.7 PLL Lock Times
        3. 7.9.2.3 Output Clock Frequency and Switching Characteristics
          1. 7.9.2.3.1 Output Clock Frequency
          2. 7.9.2.3.2 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled) (1) (1)
        4. 7.9.2.4 Internal Clock Frequencies
          1. 7.9.2.4.1 Internal Clock Frequencies (150-MHz Devices)
      3. 7.9.3 Timing Parameter Symbology
        1. 7.9.3.1 General Notes on Timing Parameters
        2. 7.9.3.2 Test Load Circuit
      4. 7.9.4 Flash Timing – Master Subsystem
        1. 7.9.4.1 Master Subsystem – Flash/OTP Endurance
        2. 7.9.4.2 Master Subsystem – Flash Parameters
        3. 7.9.4.3 Master Subsystem – Flash/OTP Access Timing
        4. 7.9.4.4 Master Subsystem – Flash Data Retention Duration
        5. 7.9.4.5 Master Subsystem – Minimum Required Flash/OTP Wait States at Different Frequencies
      5. 7.9.5 Flash Timing – Control Subsystem
        1. 7.9.5.1 Control Subsystem – Flash/OTP Endurance
        2. 7.9.5.2 Control Subsystem – Flash Parameters
        3. 7.9.5.3 Control Subsystem – Flash/OTP Access Timing
        4. 7.9.5.4 Control Subsystem – Flash Data Retention Duration
      6. 7.9.6 GPIO Electrical Data and Timing
        1. 7.9.6.1 GPIO - Output Timing
          1. 7.9.6.1.1 General-Purpose Output Switching Characteristics
        2. 7.9.6.2 GPIO - Input Timing
          1. 7.9.6.2.1 General-Purpose Input Timing Requirements
        3. 7.9.6.3 Sampling Window Width for Input Signals
        4. 7.9.6.4 Low-Power Mode Wakeup Timing
          1. 7.9.6.4.1 IDLE Mode Timing Requirements
          2. 7.9.6.4.2 IDLE Mode Switching Characteristics
          3. 7.9.6.4.3 IDLE Entry and Exit Timing Diagram
          4. 7.9.6.4.4 STANDBY Mode Timing Requirements
          5. 7.9.6.4.5 STANDBY Mode Switching Characteristics
          6. 7.9.6.4.6 STANDBY Entry and Exit Timing Diagram
          7. 7.9.6.4.7 HALT Mode Timing Requirements
          8. 7.9.6.4.8 HALT Mode Switching Characteristics
          9. 7.9.6.4.9 HALT Entry and Exit Timing Diagram
      7. 7.9.7 External Interrupt Electrical Data and Timing
        1. 7.9.7.1 External Interrupt Timing Requirements
        2. 7.9.7.2 External Interrupt Switching Characteristics
        3. 7.9.7.3 External Interrupt Timing Diagram
    10. 7.10 Analog and Shared Peripherals
      1. 7.10.1 Analog-to-Digital Converter
        1. 7.10.1.1 Sample Mode
        2. 7.10.1.2 Start-of-Conversion Triggers
        3. 7.10.1.3 Analog Inputs
        4. 7.10.1.4 ADC Result Registers and EOC Interrupts
        5. 7.10.1.5 ADC Electrical Data and Timing
          1. 7.10.1.5.1 ADC Electrical Characteristics
          2. 7.10.1.5.2 External ADC Start-of-Conversion Switching Characteristics
          3. 7.10.1.5.3 ADCSOCAO or ADCSOCBO Timing Diagram
      2. 7.10.2 Comparator + DAC Units
        1. 7.10.2.1 On-Chip Comparator and DAC Electrical Data and Timing
          1. 7.10.2.1.1 Electrical Characteristics of the Comparator/DAC
      3. 7.10.3 Interprocessor Communications
      4. 7.10.4 External Peripheral Interface
        1. 7.10.4.1 EPI General-Purpose Mode
        2. 7.10.4.2 EPI SDRAM Mode
        3. 7.10.4.3 EPI Host Bus Mode
          1. 7.10.4.3.1 EPI 8-Bit Host Bus (HB-8) Mode
            1. 7.10.4.3.1.1 HB-8 Muxed Address/Data Mode
            2. 7.10.4.3.1.2 HB-8 Non-Muxed Address/Data Mode
            3. 7.10.4.3.1.3 HB-8 FIFO Mode
          2. 7.10.4.3.2 EPI 16-Bit Host Bus (HB-16) Mode
            1. 7.10.4.3.2.1 HB-16 Muxed Address/Data Mode
            2. 7.10.4.3.2.2 HB-16 Non-Muxed Address/Data Mode
            3. 7.10.4.3.2.3 HB-16 FIFO Mode
        4. 7.10.4.4 EPI Electrical Data and Timing
          1. 7.10.4.4.1 EPI SDRAM Interface Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) (see Figure 1-1 , Figure 1-1 , and Figure 1-1 )
          2. 7.10.4.4.2 EPI SDRAM Timing Diagrams
          3. 7.10.4.4.3 EPI Host-Bus 8 and Host-Bus 16 Interface Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) (see Figure 1-1 , Figure 1-1 , Figure 1-1 , and Figure 1-1 )
          4. 7.10.4.4.4 EPI Host-Bus 8 and Host-Bus 16 Interface Timing Requirements (1) (see Figure 1-1 and Figure 1-1 )
          5. 7.10.4.4.5 EPI Host-Bus 8/16 Mode Timing Diagrams
          6. 7.10.4.4.6 EPI General-Purpose Interface Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) (see Figure 1-1 )
          7. 7.10.4.4.7 EPI General-Purpose Interface Timing Requirements (see Figure 1-1 and Figure 1-1 )
          8. 7.10.4.4.8 EPI General-Purpose Interface Timing Diagrams
    11. 7.11 Master Subsystem Peripherals
      1. 7.11.1 Synchronous Serial Interface
        1. 7.11.1.1 Bit Rate Generation
        2. 7.11.1.2 Transmit FIFO
        3. 7.11.1.3 Receive FIFO
        4. 7.11.1.4 Interrupts
        5. 7.11.1.5 Frame Formats
      2. 7.11.2 Universal Asynchronous Receiver/Transmitter
        1. 7.11.2.1 Baud-Rate Generation
        2. 7.11.2.2 Transmit and Receive Logic
        3. 7.11.2.3 Data Transmission and Reception
        4. 7.11.2.4 Interrupts
      3. 7.11.3 Cortex-M3 Inter-Integrated Circuit
        1. 7.11.3.1 Functional Overview
        2. 7.11.3.2 Available Speed Modes
        3. 7.11.3.3 I2C Electrical Data and Timing
          1. 7.11.3.3.1 I2C Timing
      4. 7.11.4 Cortex-M3 Controller Area Network
        1. 7.11.4.1 Functional Overview
      5. 7.11.5 Cortex-M3 Universal Serial Bus Controller
        1. 7.11.5.1 Functional Description
      6. 7.11.6 Cortex-M3 Ethernet Media Access Controller
        1. 7.11.6.1 Functional Overview
        2. 7.11.6.2 MII Signals
        3. 7.11.6.3 EMAC Electrical Data and Timing
          1. 7.11.6.3.1 Timing Requirements for MIITXCK (see Figure 1-1 )
          2. 7.11.6.3.2 MIITXCK Timing Diagrams
          3. 7.11.6.3.3 Timing Requirements for MIIRXCK (see Figure 1-1 )
          4. 7.11.6.3.4 MIIRXCK Timing Diagram
          5. 7.11.6.3.5 Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) for EMAC MII Transmit (see Figure 1-1 )
          6. 7.11.6.3.6 EMAC MII Transmit Timing Diagram
          7. 7.11.6.3.7 Timing Requirements for EMAC MII Receive (see Figure 1-1 )
          8. 7.11.6.3.8 EMAC MII Receive Timing Diagram
        4. 7.11.6.4 MDIO Electrical Data and Timing
          1. 7.11.6.4.1 Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) for MDIO_CK (see Figure 1-1 )
          2. 7.11.6.4.2 MDIO_CK Timing Diagram
          3. 7.11.6.4.3 Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) for MDIO as Output (see Figure 1-1 )
          4. 7.11.6.4.4 MDIO as Output Timing Diagram
          5. 7.11.6.4.5 Timing Requirements for MDIO as Input (see Figure 1-1 )
          6. 7.11.6.4.6 MDIO as Input Timing Diagram
    12. 7.12 Control Subsystem Peripherals
      1. 7.12.1 High-Resolution PWM and Enhanced PWM Modules
        1. 7.12.1.1 HRPWM Electrical Data and Timing
          1. 7.12.1.1.1 High-Resolution PWM Characteristics at SYSCLKOUT = (60–150 MHz)
        2. 7.12.1.2 ePWM Electrical Data and Timing
          1. 7.12.1.2.1 ePWM Timing Requirements
          2. 7.12.1.2.2 ePWM Switching Characteristics
          3. 7.12.1.2.3 Trip-Zone Input Timing
            1. 7.12.1.2.3.1 Trip-Zone Input Timing Requirements
      2. 7.12.2 Enhanced Capture Module
        1. 7.12.2.1 eCAP Electrical Data and Timing
          1. 7.12.2.1.1 eCAP Timing Requirement
          2. 7.12.2.1.2 eCAP Switching Characteristics
      3. 7.12.3 Enhanced Quadrature Encoder Pulse Module
        1. 7.12.3.1 eQEP Electrical Data and Timing
          1. 7.12.3.1.1 eQEP Timing Requirements
          2. 7.12.3.1.2 eQEP Switching Characteristics
      4. 7.12.4 C28x Inter-Integrated Circuit Module
        1. 7.12.4.1 Functional Overview
        2. 7.12.4.2 Clock Generation
        3. 7.12.4.3 I2C Electrical Data and Timing
          1. 7.12.4.3.1 I2C Timing
      5. 7.12.5 C28x Serial Communications Interface
        1. 7.12.5.1 Architecture
        2. 7.12.5.2 Multiprocessor and Asynchronous Communication Modes
      6. 7.12.6 C28x Serial Peripheral Interface
        1. 7.12.6.1 Functional Overview
        2. 7.12.6.2 SPI Electrical Data and Timing
          1. 7.12.6.2.1 Master Mode Timing
            1. 7.12.6.2.1.1 SPI Master Mode External Timing (Clock Phase = 0)
            2. 7.12.6.2.1.2 SPI Master Mode External Timing (Clock Phase = 1)
          2. 7.12.6.2.2 Slave Mode Timing
            1. 7.12.6.2.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
            2. 7.12.6.2.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
      7. 7.12.7 C28x Multichannel Buffered Serial Port
        1. 7.12.7.1 McBSP Electrical Data and Timing
          1. 7.12.7.1.1 McBSP Transmit and Receive Timing
            1. 7.12.7.1.1.1 McBSP Timing Requirements
            2. 7.12.7.1.1.2 McBSP Switching Characteristics
            3. 7.12.7.1.1.3 McBSP Timing Diagrams
          2. 7.12.7.1.2 McBSP as SPI Master or Slave Timing
            1. 7.12.7.1.2.1  McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. 7.12.7.1.2.2  McBSP as SPI Master or Slave Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) (CLKSTP = 10b, CLKXP = 0)
            3. 7.12.7.1.2.3  McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 Timing Diagram
            4. 7.12.7.1.2.4  McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            5. 7.12.7.1.2.5  McBSP as SPI Master or Slave Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) (CLKSTP = 11b, CLKXP = 0)
            6. 7.12.7.1.2.6  McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 Timing Diagram
            7. 7.12.7.1.2.7  McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            8. 7.12.7.1.2.8  McBSP as SPI Master or Slave Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) (CLKSTP = 10b, CLKXP = 1)
            9. 7.12.7.1.2.9  McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 Timing Diagram
            10. 7.12.7.1.2.10 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            11. 7.12.7.1.2.11 McBSP as SPI Master or Slave Switching Characteristics Over Recommended Operating Conditions (Unless Otherwise Noted) (CLKSTP = 11b, CLKXP = 1)
            12. 7.12.7.1.2.12 McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 Timing Diagram
  8. 8 Detailed Description
    1. 8.1  Memory Maps
      1. 8.1.1 Control Subsystem Memory Map
      2. 8.1.2 Master Subsystem Memory Map
    2. 8.2  Identification
    3. 8.3  Master Subsystem
      1. 8.3.1 Cortex-M3 CPU
      2. 8.3.2 Cortex-M3 DMA and NVIC
      3. 8.3.3 Cortex-M3 Interrupts
      4. 8.3.4 Cortex-M3 Vector Table
      5. 8.3.5 Cortex-M3 Local Peripherals
      6. 8.3.6 Cortex-M3 Local Memory
      7. 8.3.7 Cortex-M3 Accessing Shared Resources and Analog Peripherals
    4. 8.4  Control Subsystem
      1. 8.4.1 C28x CPU/FPU/VCU
      2. 8.4.2 C28x Core Hardware Built-In Self-Test
      3. 8.4.3 C28x Peripheral Interrupt Expansion
      4. 8.4.4 C28x Direct Memory Access
      5. 8.4.5 C28x Local Peripherals
      6. 8.4.6 C28x Local Memory
      7. 8.4.7 C28x Accessing Shared Resources and Analog Peripherals
    5. 8.5  Analog Subsystem
      1. 8.5.1 ADC1
      2. 8.5.2 ADC2
      3. 8.5.3 Analog Comparator + DAC
      4. 8.5.4 Analog Common Interface Bus
    6. 8.6  Master Subsystem NMIs
    7. 8.7  Control Subsystem NMIs
    8. 8.8  Resets
      1. 8.8.1 Cortex-M3 Resets
      2. 8.8.2 C28x Resets
      3. 8.8.3 Analog Subsystem and Shared Resources Resets
      4. 8.8.4 Device Boot Sequence
    9. 8.9  Internal Voltage Regulation and Power-On-Reset Functionality
      1. 8.9.1 Analog Subsystem: Internal 1.8-V VREG
      2. 8.9.2 Digital Subsystem: Internal 1.2-V VREG
      3. 8.9.3 Analog and Digital Subsystems: Power-On-Reset Functionality
      4. 8.9.4 Connecting ARS and XRS Pins
    10. 8.10 Input Clocks and PLLs
      1. 8.10.1 Internal Oscillator (Zero-Pin)
      2. 8.10.2 Crystal Oscillator/Resonator (Pins X1/X2 and VSSOSC)
      3. 8.10.3 External Oscillators (Pins X1 and XCLKIN)
      4. 8.10.4 Main PLL
      5. 8.10.5 USB PLL
    11. 8.11 Master Subsystem Clocking
      1. 8.11.1 Cortex-M3 Run Mode
      2. 8.11.2 Cortex-M3 Sleep Mode
      3. 8.11.3 Cortex-M3 Deep Sleep Mode
    12. 8.12 Control Subsystem Clocking
      1. 8.12.1 C28x Normal Mode
      2. 8.12.2 C28x IDLE Mode
      3. 8.12.3 C28x STANDBY Mode
    13. 8.13 Analog Subsystem Clocking
    14. 8.14 Shared Resources Clocking
    15. 8.15 Loss of Input Clock (NMI Watchdog Function)
    16. 8.16 GPIOs and Other Pins
      1. 8.16.1 GPIO_MUX1
      2. 8.16.2 GPIO_MUX2
      3. 8.16.3 AIO_MUX1
      4. 8.16.4 AIO_MUX2
    17. 8.17 Emulation/JTAG
    18. 8.18 Code Security Module
      1. 8.18.1 Functional Description
    19. 8.19 µCRC Module
      1. 8.19.1 Functional Description
      2. 8.19.2 CRC Polynomials
      3. 8.19.3 CRC Calculation Procedure
      4. 8.19.4 CRC Calculation for Data Stored In Secure Memory
  9. 9 Applications, Implementation, and Layout
    1. 9.1 TI Reference Design
  10. 10Device and Documentation Support
    1. 10.1 Device and Development Support Tool Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Trademarks
    5. 10.5 Support Resources
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.16.3 AIO_MUX1

The ten pins of AIO_MUX1 can be selectively mapped through a dedicated set of registers to 12 analog inputs for ADC1 peripheral, six analog inputs for Comparator peripherals, four General-Purpose Inputs, or four General-Purpose Outputs. While AIO_MUX1 has been named after the analog signals passing through it, the GPIOs (here called AIOs) are still digital, although with fewer features than those in the GPIO_MUX1 and GPIO_MUX2 blocks—for example, they do not offer pullups. On reset, all pins of the AIO_MUX1 block are configured as analog inputs and the GPIO function is disabled. The AIO_MUX1 block is programmed through a separate set of registers from those used to program AIO_MUX2.

The multiple registers responsible for configuring the AIO_MUX1 pins are accessible by the C28x CPU only. The top portion of Figure 8-17 shows Control Subsystem registers and muxing logic for the associated ten AIO pins. The AIOMUX1 register selects one of ten possible analog input signals or one of four general-purpose AIO inputs. Other registers allow reading and writing of the four AIO bits, as well as setting the direction for each of the bits (read or write). See Table 8-31 for the mapping of analog inputs and AIOs to the ten pins of AIO_MUX1.

AIO Mode 0 is chosen by setting selected odd bits of the AIOMUX1 register to ‘0’. AIO Mode 1 is chosen by setting selected odd bits of the AIOMUX1 register to ‘1’. For example, setting bit 5 of the AIOMUX1 register to ‘0’ assigns pin ADC1INA2 to internal signal AIO2 (digital GPIO). Setting bit 5 of the AIOMUX1 register to ‘1’ assigns pin ADC1INA2 to analog inputs ADC1INA2 or COMPA1 (only one should be enabled at a time in the respective analog module). Currently, all even bits of the AIOMUX1 register are “don’t cares”.

Table 8-31 AIO_MUX1 Pin Assignments (C28x AIO Modes)
DEVICE PIN NAME(1)(2) C28x AIO MODE 0(3) C28x AIO MODE 1(4)
ADC1INA0 – ADC1INA0
ADC1INA2 AIO2 ADC1INA2, COMPA1
ADC1INA3 – ADC1INA3
ADC1INA4 AIO4 ADC1INA4, COMPA2
ADC1INA6 AIO6 ADC1INA6, COMPA3
ADC1INA7 – ADC1INA7
ADC1INB0 – ADC1INB0
ADC1INB3 – ADC1INB3
ADC1INB4 AIO12 ADC1INB4, COMPB2
ADC1INB7 – ADC1INB7
(1) Blank fields represent Reserved functions.
(2) For each field with two pins (for example, ADC1INA2, COMPA1), only one pin should be enabled at a time; the other pin should be disabled. Use registers inside the respective destination analog peripherals to enable or disable these inputs.
(3) AIO Mode 0 represents digital general-purpose inputs or outputs.
(4) AIO Mode 1 represents analog inputs for ADC1 or the Comparator module.