SNOSCY5B August   2014  – April 2015 FDC1004

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristicsnote to Electrical Characteristics table
    6. 7.6 I2C Interface Voltage Level
    7. 7.7 I2C Interface Timing
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 The Shield
      2. 8.3.2 The CAPDAC
      3. 8.3.3 Capacitive System Offset Calibration
      4. 8.3.4 Capacitive Gain Calibration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Single Ended Measurement
      2. 8.4.2 Differential Measurement
    5. 8.5 Programming
      1. 8.5.1 Serial Bus Address
      2. 8.5.2 Read/Write Operations
      3. 8.5.3 Device Usage
        1. 8.5.3.1 Measurement Configuration
        2. 8.5.3.2 Triggering Measurements
        3. 8.5.3.3 Wait for Measurement Completion
        4. 8.5.3.4 Read of Measurement Result
    6. 8.6 Register Maps
      1. 8.6.1 Registers
        1. 8.6.1.1 Capacitive Measurement Registers
      2. 8.6.2 Measurement Configuration Registers
      3. 8.6.3 FDC Configuration Register
      4. 8.6.4 Offset Calibration Registers
      5. 8.6.5 Gain Calibration Registers
      6. 8.6.6 Manufacturer ID Register
      7. 8.6.7 Device ID Register
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Liquid Level Sensor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plot
    3. 9.3 Do's and Don'ts
    4. 9.4 Initialization Set Up
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

WSON (DSC)
10 Pins
TOP
FDC1004 PINOUT_2.gif
VSSOP (DGS)
10 Pins
TOP
FDC1004 pkg_snoscz4.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
SHLD1 1 A Capacitive Input Active AC Shielding.
CIN1 2 A Capacitive Input. The measured capacitance is connected between the CIN1 pin and GND. If not used, this pin should be left as an open circuit.
CIN2 3 A Capacitive Input. The measured capacitance is connected between the CIN2 pin and GND. If not used, this pin should be left as an open circuit.
CIN3 4 A Capacitive Input. The measured capacitance is connected between the CIN3 pin and GND. If not used, this pin should be left as an open circuit.
CIN4 5 A Capacitive Input. The measured capacitance is connected between the CIN4 pin and GND. If not used, this pin should be left as an open circuit.
SHLD2 6 A Capacitive Input Active AC Shielding.
GND 7 G Ground
VDD 8 P Power Supply Voltage. This pin should be decoupled to GND, using a low impedance capacitor, for example in combination with a 1-μF tantalum and a 0.1-μF multilayer ceramic.
SCL 9 I Serial Interface Clock Input. Connects to the master clock line. Requires pull-up resistor if not already provided elsewhere in the system.
SDA 10 I/O Serial Interface Bidirectional Data. Connects to the master data line. Requires a pull-up resistor if not provided elsewhere in the system.
DAP(2) - N/A Connect to GND
(1) P=Power, G=Ground, I=Input, O=Output, A=Analog, I/O=Bi-Directional Input/Output
(2) There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the DAP as the primary ground for the device. The device GND pin must always be connected to ground.