SLLSES1E December 2015 – July 2025 HD3SS3220 , HD3SS3220L
PRODUCTION DATA
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| CC2 | 1 | I/O | Type-C Configuration channel signal 2 |
| CC1 | 2 | I/O | Type-C Configuration channel signal 1 |
| CURRENT_MODE | 3 | I | Tri-level input pin to indicate current advertisement in DFP (or DFP in DRP) mode
while in GPIO mode. Don’t care in UFP mode. Provides the flexibility
to advertise higher current without I2C. The pin has 250K
internal pull-down. L – Low - Default – 900mA M - Medium (Install 500K to VDD5 on the PCB) – 1.5A H - High (Install 10K to VDD5 on the PCB) – 3A |
| PORT | 4 | I | Tri-level input pin to indicate port mode. The state of this pin is sampled when HD3SS3220’s ENn_CC is asserted low, and VDD5 is active. This pin is also sampled following a I2C_SOFT_RESET. H - DFP (Pull-up to VDD5 if DFP mode is desired) NC - DRP (Leave unconnected if DRP mode is desired) L - UFP (Pull-down or tie to GND if UFP mode is desired) |
| VBUS_DET | 5 | I | 5-28V VBUS input voltage. VBUS detection determines UFP attachment. One 900K external resistor required between system VBUS and VBUS_DET pin. |
| TXp | 6 | I/O | Host/Device USB SuperSpeed differential Signal TX positive |
| TXn | 7 | I/O | Host/Device USB SuperSpeed differential Signal TX negative |
| VCC33 | 8 | P | 3.3-V Power supply |
| RXp | 9 | I/O | Host/Device USB SuperSpeed differential Signal RX positive |
| RXn | 10 | I/O | Host/Device USB SuperSpeed differential Signal RX negative |
| DIR | 11 | O | Type-C plug orientation. Open drain output. A pull-up resistor (that is, 200K) must be installed for proper operation of the device. |
| ENn_MUX | 12 | I | Active Low MUX Enable: L - Normal operation, and H - Shutdown. |
| GND | 13, 28 | G | Ground |
| RX1n | 14 | I/O | Type-C Port - USB SuperSpeed differential Signal RX1 negative |
| RX1p | 15 | I/O | Type-C Port - USB SuperSpeed differential Signal RX1 positive |
| TX1n | 16 | I/O | Type-C Port - USB SuperSpeed differential Signal TX1 negative |
| TX1p | 17 | I/O | Type-C Port - USB SuperSpeed differential Signal TX1 positive |
| RX2n | 18 | I/O | Type-C Port - USB SuperSpeed differential Signal RX2 negative |
| RX2p | 19 | I/O | Type-C Port - USB SuperSpeed differential Signal RX2 positive |
| TX2n | 20 | I/O | Type-C Port - USB SuperSpeed differential Signal TX2 negative |
| TX2p | 21 | I/O | Type-C Port - USB SuperSpeed differential Signal TX2 positive |
| ADDR | 22 | I | Tri-level input pin to indicate I2C address or GPIO mode: H (connect to VDD5) - I2C is enabled and I2C 7-bit address is 0x67. NC - GPIO mode (I2C is disabled) L (connect to GND) - I2C is enabled and I2C 7-bit address is 0x47. ADDR pin should be pulled up to VDD5 if high configuration is desired |
| INT_N/OUT3 | 23 | O | The INT_N/OUT3 is a dual-function pin. When used as the INT_N, the pin is an open drain output in I2C control mode and is an active low interrupt signal for indicating changes in I2C registers. When used as OUT3, the pin is in audio accessory detect in GPIO mode: H - no detection, and L - audio accessory connection detected. For HD3SS3220L, OUT3 is a No Connect(NC) pin. |
| VCONN_FAULT_N | 24 | O | Open drain output. Asserted low when VCONN overcurrent detected. |
| SDA/OUT1 | 25 | I/O | The SDA/OUT1 is a dual-function pin. When I2C is enabled (ADDR pin is high or low), this pin is the I2C communication data signal. When in GPIO mode (ADDR pin is NC), this pin is an open drain output for communicating Type-C current mode detect when the device is in UFP mode: H – Default (900 mA) current mode detected, and L – Medium (1.5 A) or High (3 A) Current Mode detected. |
| SCL/OUT2 | 26 | I/O | The SCL/OUT2 is a dual function pin. When I2C is enabled (ADDR pin is high or low), this pin is the I2C communication clock signal. When in GPIO mode (ADDR pin is NC), this pin is an open drain output for communicating Type-C current mode detect when the device is in UFP mode: H – Default or Medium current mode detected, and L – High current mode detected. |
| ID | 27 | O | Open drain output. Asserted low when CC pin detected device attachment when port is a source (DFP), or dual-role (DRP) acting as source (DFP). |
| ENn_CC | 29 | I | Enable signal for CC controller. Enable is active low. |
| VDD5 | 30 | P | 5V Power supply |
| Thermal Pad | – | – | The thermal PAD must be connected to GND, see the Thermal Pad connection techniques (PowerPAD™ Thermally Enhanced Package application note). |