SNAS678B May   2018  – May 2019 HDC2080

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Typical Application
  3. 3 Description
    1.     RH Accuracy (TA = 30°C)
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Electrical Characteristics
    7. 7.7 I2C Interface Timing Requirements
    8. 7.8 Timing Diagram
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sleep Mode Power Consumption
      2. 8.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement
      3. 8.3.3 Heater
      4. 8.3.4 Interrupt Description
        1. 8.3.4.1 DRDY
      5. 8.3.5 INTERRUPT on Threshold
        1. 8.3.5.1 Temperature High
        2. 8.3.5.2 Temperature Low
        3. 8.3.5.3 Humidity High
        4. 8.3.5.4 Humidity Low
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs. Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
      3. 8.5.3 Serial Bus Address
      4. 8.5.4 Read and Write Operations
    6. 8.6 Register Maps
      1. 8.6.1  Address 0x00 Temperature LSB
        1. Table 1. Address 0x00 Temperature LSB Register
        2. Table 7. Address 0x00 Temperature LSB Field Descriptions
      2. 8.6.2  Address 0x01 Temperature MSB
        1. Table 2. Address 0x01 Temperature MSB Register
        2. Table 8. Address 0x01 Temperature MSB Field Descriptions
      3. 8.6.3  Address 0x02 Humidity LSB
        1. Table 3. Address 0x02 Humidity LSB Register
        2. Table 9. Address 0x02 Humidity LSB Field Descriptions
      4. 8.6.4  Address 0x03 Humidity MSB
        1. Table 4.  Address 0x03 Humidity MSB Register
        2. Table 10. Address 0x03 Temperature MSB Field Descriptions
      5. 8.6.5  Address 0x04 Interrupt DRDY
        1. Table 5.  Address 0x04 Interrupt DRDY Register
        2. Table 11. Address 0x04 Interrupt DRDY Field Descriptions
      6. 8.6.6  Address 0x05 Temperature MAX
        1. Table 6.  Address 0x05 Temperature MAX Register
        2. Table 12. Address 0x05 Temperature Max Field Descriptions
      7. 8.6.7  Address 0x06 Humidity MAX
        1. Table 7.  Address 0x06 Humidity MAX Register
        2. Table 13. Address 0x06 Humidity MAX Field Descriptions
      8. 8.6.8  Address 0x07 Interrupt Configuration
        1. Table 8.  Address 0x07 Interrupt Configuration Register
        2. Table 14. Address 0x07 Interrupt Configuration Field Descriptions
      9. 8.6.9  Address 0x08 Temperature Offset Adjustment
        1. Table 9.  Address 0x08 Temperature Offset Adjustment Register
        2. Table 15. Address 0x08 Temperature Offset Adjustment Field Descriptions
      10. 8.6.10 Address 0x09 Humidity Offset Adjustment
        1. Table 10. Address 0x09 Humidity Offset Adjustment Register
        2. Table 16. Address 0x09 Humidity Offset Adjustment Field Descriptions
      11. 8.6.11 Address 0x0A Temperature Threshold LOW
        1. Table 11. Address 0x0A Temperature Threshold LOW Register
        2. Table 17. Address 0x0A Temperature Threshold LOW Field Descriptions
      12. 8.6.12 Address 0x0B Temperature Threshold HIGH
        1. Table 12. Address 0x0B Temperature Threshold HIGH Register
        2. Table 18. Address 0x0B Temperature Threshold HIGH Field Descriptions
      13. 8.6.13 Address 0x0C Humidity Threshold LOW
        1. Table 13. Address 0x0C Humidity Threshold LOW Register
        2. Table 19. Address 0x0C Humidity Threshold LOW Field Descriptions
      14. 8.6.14 Address 0x0D Humidity Threshold HIGH
        1. Table 14. Address 0x0D Humidity Threshold HIGH Register
        2. Table 20. Address 0x0D Humidity Threshold HIGH Field Descriptions
      15. 8.6.15 Address 0x0E Reset and DRDY/INT Configuration Register
        1. Table 15. Address 0x0E Configuration Register
        2. Table 21. Address 0x0E Configuration Field Descriptions
      16. 8.6.16 Address 0x0F Measurement Configuration
        1. Table 16. Address 0x0F Measurement Configuration Register
        2. Table 22. Address 0x0F Measurement Configuration Field Descriptions
      17. 8.6.17 Manufacturer ID Low
        1. Table 17. Manufacturer ID Low Register
        2. Table 23. Address 0xFC Manufacturer ID Low Field Descriptions
      18. 8.6.18 Manufacturer ID High
        1. Table 18. Manufacturer ID High Register
        2. Table 24. Address 0xFD Manufacturer ID High Field Descriptions
      19. 8.6.19 Device ID Low
        1. Table 19. Device ID Low Register
        2. Table 25. Address 0xFE Device ID Low Field Descriptions
      20. 8.6.20 Device ID High
        1. Table 20. Device ID High Register
        2. Table 26. Address 0xFF Device ID High Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Guidelines for HDC2080 Storage and PCB Assembly
        1. 11.1.1.1 Storage and Handling
        2. 11.1.1.2 Soldering Reflow
        3. 11.1.1.3 Rework
        4. 11.1.1.4 High Temperature and Humidity Exposure
        5. 11.1.1.5 Bake/Re-Hydration Procedure
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1.1.3 Rework

TI recommends to limit the HDC2080 to a single IR reflow with no rework, but a second reflow may be possible if the following guidelines are met:

  • The exposed polymer (humidity sensor) is kept clean and undamaged.
  • The no-clean solder paste is used and the process is not exposed to any liquids, such as water or solvents.
  • The Peak soldering temperature does not exceed 260°C.