SNAS778A June   2021  – September 2021 HDC3020 , HDC3021 , HDC3022

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Factory Installed Polyimide Tape
      2. 8.3.2  Factory Installed IP67 Protection Cover
      3. 8.3.3  Measurement of Relative Humidity and Temperature
      4. 8.3.4  Drift Correction: Accuracy Restoration
      5. 8.3.5  NIST Traceability of Relative Humidity and Temperature Sensor
      6. 8.3.6  Measurement Modes: Trigger-On Demand vs. Auto Measurement
      7. 8.3.7  Heater
      8. 8.3.8  ALERT Output With Programmable Interrupts
      9. 8.3.9  Checksum Calculation
      10. 8.3.10 Programmable Offset of Relative Humidity and Temperature Results
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs. Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 I2C Serial Bus Address Configuration
      3. 8.5.3 I2C Write - Send Device Command
      4. 8.5.4 I2C Read - Retrieve Single Data Result
      5. 8.5.5 I2C Read - Retrieve Multi Data Result
      6. 8.5.6 I2C Repeated START - Send Command and Retrieve Data Results
      7. 8.5.7 Command Table and Detailed Description
        1. 8.5.7.1 Reset
          1. 8.5.7.1.1 Soft Reset
          2. 8.5.7.1.2 I2C General Call Reset
        2. 8.5.7.2 Trigger-On Demand
        3. 8.5.7.3 Auto Measurement Mode
          1. 8.5.7.3.1 Auto Measurement Mode: Enable and Configure Measurement Interval
          2. 8.5.7.3.2 Auto Measurement Mode: Measurement Readout
          3. 8.5.7.3.3 Auto Measurement Mode: Exit
          4. 8.5.7.3.4 Auto Measurement Mode: Measurement History Readout
          5. 8.5.7.3.5 Override Default Device Power-On and Device-Reset State
        4. 8.5.7.4 ALERT Output Configuration
          1. 8.5.7.4.1 ALERT Output: Environmental Tracking of Temperature and Relative Humidity
          2. 8.5.7.4.2 ALERT Output: Representation of Environmental Thresholds and Default Threshold Values
          3. 8.5.7.4.3 ALERT Output: Steps to Calculate and Program Environmental Thresholds
          4. 8.5.7.4.4 ALERT Output: Deactivation of Environmental Tracking
          5. 8.5.7.4.5 ALERT Output: Transfer Thresholds into Non-Volatile Memory
        5. 8.5.7.5 Programmable Measurement Offset
          1. 8.5.7.5.1 Representation of Offset Value and Factory Shipped Default Value
          2. 8.5.7.5.2 Factory Shipped Default Offset Values
          3. 8.5.7.5.3 Calculate Relative Humidity Offset Value
          4. 8.5.7.5.4 Calculate Temperature Offset Value
          5. 8.5.7.5.5 Write an Offset Value
          6. 8.5.7.5.6 Verify a Programmed Offset Value
        6. 8.5.7.6 Status Register
        7. 8.5.7.7 Heater: Enable and Disable
        8. 8.5.7.8 Read NIST ID/Serial Number
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Storage and PCB Assembly
      1. 11.3.1 Storage and Handling
      2. 11.3.2 Soldering Reflow
      3. 11.3.3 Rework
      4. 11.3.4 Exposure to High Temperature and High Humidity Conditions
      5. 11.3.5 Bake/Rehydration Procedure
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
    2. 13.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DEF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics

TA = -40°C to 125°C and VDD = 1.62V to 5.50V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SCL, SDA PINS
fSCL SCL clock frequency(1) 0.001 1 MHz
tHIGH High period of the SCL clock(1) 0.6 µs
tLOW LOW period of the SCL clock(1) 1.3 µs
tSU;DAT Setup Time: Data(1) 100 ns
tHD;DAT Hold Time: Data(1) 0 µs
tSU;STA Set-up time: Repeated START condition(1) 0.6 µs
tHD;STA Hold time: Repeated START condition(1) (2) 0.6 µs
tSU;STO Set-up time: STOP condition(1) 0.6 µs
tR;SCL Rise Time: SCL(1) 300 ns
tR;SDA Rise Time: SDA(1) 300 ns
tF;SCL Fall Time: SCL(1) 20*(VDD/5.5V) 300 ns
tF;SDA Fall Time: SDA(1) 20*(VDD/5.5V) 300 ns
tBUF Bus free time between a STOP and START condition(1) 1.3 µs
tVD;DAT Data valid time(1) (3) 0.9 µs
tVD;ACK Data valid acknowledge time(1) (4) 0.9 µs
RESET
tRESET_NPW Negative pulse width to trigger hard reset 1 µs
EEPROM (T, RH OFFSET)
tOS_PROG Offset Programming Time 10 15 ms
Guaranteed by design/characterization; not production tested
After this period, the first clock pulse is generated
Time for data signal from SCL low to SDA output (high to low, depending on which is worse)
Time for acknowledement signal from SCL low to SDA output (high or low, depending on which is worse)