SNAS778C June   2021  – December 2022 HDC3020 , HDC3021 , HDC3022

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Factory Installed Polyimide Tape
      2. 8.3.2  Factory Installed IP67 Protection Cover
      3. 8.3.3  Measurement of Relative Humidity and Temperature
      4. 8.3.4  Offset Error Correction: Accuracy Restoration
      5. 8.3.5  NIST Traceability of Relative Humidity and Temperature Sensor
      6. 8.3.6  Measurement Modes: Trigger-On Demand vs Auto Measurement
      7. 8.3.7  Heater
      8. 8.3.8  ALERT Output With Programmable Interrupts
      9. 8.3.9  Checksum Calculation
      10. 8.3.10 Programmable Offset of Relative Humidity and Temperature Results
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 I2C Serial Bus Address Configuration
      3. 8.5.3 I2C Write - Send Device Command
      4. 8.5.4 I2C Read - Retrieve Single Data Result
      5. 8.5.5 I2C Read - Retrieve Multi Data Result
      6. 8.5.6 I2C Repeated START - Send Command and Retrieve Data Results
      7. 8.5.7 Command Table and Detailed Description
        1. 8.5.7.1 Reset
          1. 8.5.7.1.1 Soft Reset
          2. 8.5.7.1.2 I2C General Call Reset
        2. 8.5.7.2 Trigger-On Demand
        3. 8.5.7.3 Auto Measurement Mode
          1. 8.5.7.3.1 Auto Measurement Mode: Enable and Configure Measurement Interval
          2. 8.5.7.3.2 Auto Measurement Mode: Measurement Readout
          3. 8.5.7.3.3 Auto Measurement Mode: Exit
          4. 8.5.7.3.4 Auto Measurement Mode: Measurement History Readout
          5. 8.5.7.3.5 Override Default Device Power-On and Device-Reset State
        4. 8.5.7.4 ALERT Output Configuration
          1. 8.5.7.4.1 ALERT Output: Environmental Tracking of Temperature and Relative Humidity
          2. 8.5.7.4.2 ALERT Output: Representation of Environmental Thresholds and Default Threshold Values
          3. 8.5.7.4.3 ALERT Output: Steps to Calculate and Program Environmental Thresholds
          4. 8.5.7.4.4 ALERT Output: Deactivation of Environmental Tracking
          5. 8.5.7.4.5 ALERT Output: Transfer Thresholds into Non-Volatile Memory
        5. 8.5.7.5 Programmable Measurement Offset
          1. 8.5.7.5.1 Representation of Offset Value and Factory Shipped Default Value
          2. 8.5.7.5.2 Factory Shipped Default Offset Values
          3. 8.5.7.5.3 Calculate Relative Humidity Offset Value
          4. 8.5.7.5.4 Calculate Temperature Offset Value
          5. 8.5.7.5.5 Write an Offset Value
          6. 8.5.7.5.6 Verify a Programmed Offset Value
        6. 8.5.7.6 Status Register
        7. 8.5.7.7 Heater: Enable and Disable
        8. 8.5.7.8 Heater: Configure Level of Heater Current
        9. 8.5.7.9 Read NIST ID/Serial Number
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Storage and PCB Assembly
        1. 9.4.3.1 Storage and Handling
        2. 9.4.3.2 Soldering Reflow
        3. 9.4.3.3 Rework
        4. 9.4.3.4 Exposure to High Temperature and High Humidity Conditions
        5. 9.4.3.5 Bake/Rehydration Procedure
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DEJ|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

TA = -40°C to 125°C, VDD = 1.62V to 5.50V (unless otherwise noted), Typical Specifications are TA = 25°C, VDD = 1.8V unless otherwise noted 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Relative Humidity Sensor
RHACC
Accuracy (3)(4) 		 TA = 25°C, 10% to 50% RH ±0.5 ±2.0 %RH
TA = 25°C, 10% to 70% RH ±1.0 ±2.0
TA = 25°C, 10% to 80% RH ±1.0 ±2.5
TA = 25°C, 10% to 90% RH ±1.5 ±3.0
RHREP Repeatability Low Power Mode 0 (lowest noise) ±0.02 %RH
Low Power Mode 1 ±0.02
Low Power Mode 2 ±0.03
Low Power Mode 3 (lowest power) ±0.04
RHHYS Hysteresishref 10% to 90% RH
 ±0.8 %RH
RHRT Response Timehrefhref 10% to 90% RH
t63% step.
 4 s
RHLTD Long-term Drift(4)
0.19 %RH/yr
Temperature Sensor
TACC Accuracy
0°C ≤ TA ≤ 50°C		 ±0.1 ±0.2 °C

-40°C ≤ TA ≤ 100°C		 ±0.1 ±0.3

-40°C ≤ TA < 125°C		 ±0.1 ±0.4
TREP Repeatability Low Power Mode 0 (lowest noise) ±0.04 °C
Low Power Mode 1 ±0.05
Low Power Mode 2 ±0.06
Low Power Mode 3 (lowest power) ±0.08
TRT Response Time (stirred liquid) (7)(13) 25C <TA< 75C
t63% step
Roger's 4350B PCB 1.575mm thickness 
 2 s
TLTD Long Term Drift ±0.03 °C/yr
Sensor Timing
tmeas Measurement Duration(8) Low Power Mode 0 (lowest noise) 12.5 14.1 ms
Low Power Mode 1 7.5 8.4
Low Power Mode 2 5.0 5.7
Low Power Mode 3 (lowest power) 3.7 4.2
SCL, SDA Pins
VIL LOW-level input voltage 0.3*VDD V
VIH HIGH-level input voltage 0.7*VDD V
VOL LOW-level output voltage IOL = 3 mA 0.4 V
Control Pins
VOH High-level Output Voltage - ALERT IOH = -100 µA VDD–0.2 V
High-level Output Voltage - ALERT IOH = -3 mA VDD–0.4 V
VOL Low-level Output Voltage - ALERT IOL = 100 µA 0.2 V
Low-level Output Voltage - ALERT IOL = 3 mA 0.4 V
VIH High Level Input Voltage - ADDR, ADDR1, RESET 0.7*VDD V
VIL Low Level Input Voltage - ADDR, ADDR1, RESET 0.3*VDD V
II Input Leakage Current - ADDR and ADDR1 VI = VDD or GND -0.5 0.5 µA
Power Supply
IDD_ACTIVE Active Current(1) Low Power Mode 0 (lowest noise) 110 170 µA
Low Power Mode 1 108 165
Low Power Mode 2 103 155
Low Power Mode 3 (lowerest power) 99 153
IDD_SLEEP Sleep Current(1) No Active Measurement
trigger on demand mode		 0.36 14.5 µA
No Active Measurement, 
auto measurement mode		 0.54 15.0
IDD_AVG_EQN Averaged Current Equation measurement freq = numbers of samples per second See (9)
IDD_AVG Averaged Current(1)(2) trigger on demand mode, low Power Mode 3 (lowest Power)
triggered at 1 sample per second		 0.7 µA
trigger on demand mode, low Power Mode 3 (lowest Power)
triggered at 1 sample per 5 seconds		 0.4
automeasurement mode, Low Power Mode 0 (lowest noise)
1 sample per second		 1.9
automeasurement mode, Low Power Mode 1
1 sample per second		 1.3
automeasurement mode, Low Power Mode 2
1 sample per second		 1.0
automeasurement mode, low Power Mode 3 (lowest power)
1 sample per second		 0.9
automeasurement mode, Low Power Mode 3 (lowest power)
1 sample every two seconds
 0.7
PHEATER Heater Power (11) Full Power 0x3FFF, VDD = 3.3V 249 368 mW
Half Power 0x03FF, VDD = 3.3V 137 203
Quarter Power 0x009F, VDD = 3.3V 67 100
VPOR Power on reset threshold voltage supply rising 1.35 V
VBOR Brown out detect voltage supply falling 1.19 V
SensorPUR  Power Up Ready Sensor ready once VDD ≥ 1.62V 3.5 5.0 ms
SensorRR Reset Ready Sensor ready after a reset 1.3 3.0 ms
RRESET RESET pin internal pull up resistance 49 kΩ
tRESET_NPW Negative pulse width to trigger hard reset 1 µS
EEPROM (T, RH offset, and alert)
OSEND Program Endurance 1000 50000 Cycles
OSRET Data Retention Time 100% Power-On hours 10 100 Years
tPROG Offset and Alert Programming Time 53 77 ms
IEEPROM EEPROM write quiescent current No active measurement; serial bus inactive  525 µA
(1) Does not include I2C read/write communication or pullup resistor current through SCL and SDA
(2) Average current consumption while conversion is in progress
(3) Excludes hysteresis and long-term drift
(4) Based on THB (temperature humidity bias) testing using Arrhenius-Peck acceleration model. Excludes the impact of dust, gas phase solvents and other contaminents such as vapors from packaging materials, adhesives, or taptes, etc.
(5) The hysteresis value is the difference between the RH measurement in a rising and falling RH environment, at a specific RH point
(6) Actual response times will vary dependent on system thermal mass and air-flow
(7) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity
(8) Measurement duration includes the time to measure RH plus Temp
(9) IDD_AVG_EQN = measurement freq x IDD_ACTIVE x tmeas+ Isleep x (1- (measurement freq x tmeas))
make sure units match eg. measurement frequency in Hz, tmeas in seconds, and all the currents in the same unit
(10) Time for the T output to change by 63% of the total T change after a step change in environmental temperature
(11) More details on the heater can be found in the HDC3x Silicon User's Guide