SLYS018C April   2018  – April 2020 INA181-Q1 , INA2181-Q1 , INA4181-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Circuit
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions: INA181-Q1 (Single Channel)
    2.     Pin Functions: INA2181-Q1 (Dual Channel) and INA4181-Q1 (Quad Channel)
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 High Bandwidth and Slew Rate
      2. 8.3.2 Bidirectional Current Monitoring
      3. 8.3.3 Wide Input Common-Mode Voltage Range
      4. 8.3.4 Precise Low-Side Current Sensing
      5. 8.3.5 Rail-to-Rail Output Swing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Unidirectional Mode
      3. 8.4.3 Bidirectional Mode
      4. 8.4.4 Input Differential Overload
      5. 8.4.5 Shutdown Mode
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Basic Connections
      2. 9.1.2 RSENSE and Device Gain Selection
      3. 9.1.3 Signal Filtering
      4. 9.1.4 Summing Multiple Currents
      5. 9.1.5 Detecting Leakage Currents
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Common-Mode Transients Greater Than 26 V
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC (1) INA181-Q1 INA2181-Q1 INA4181-Q1 UNIT
DBV (SOT-23) DGS (VSSOP) PW (TSSOP)
6 PINS 10 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 198.7 177.3 97.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 120.9 68.7 37.7 °C/W
RθJB Junction-to-board thermal resistance 52.3 98.4 48.3 °C/W
ψJT Junction-to-top characterization parameter 30.3 12.6 3.6 °C/W
ψJB Junction-to-board characterization parameter 52.0 96.9 47.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.