SBOS644C February   2013  – March 2018 INA231

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      High-or Low-Side Sensing
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: I2C Bus
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic Analog-to-Digital Converter (ADC) Functions
        1. 8.3.1.1 Power Calculation
        2. 8.3.1.2 ALERT Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging and Conversion Time Considerations
    5. 8.5 Programming
      1. 8.5.1 Configure, Measure, and Calculate Example
      2. 8.5.2 Programming the Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default INA231 Settings
      5. 8.5.5 Writing to and Reading from the INA231
        1. 8.5.5.1 Bus Overview
          1. 8.5.5.1.1 Serial Bus Address
          2. 8.5.5.1.2 Serial Interface
        2. 8.5.5.2 High-Speed I2C Mode
      6. 8.5.6 SMBus Alert Response
    6. 8.6 Register Maps
      1. Table 3. Summary of Register Set
      2. 8.6.1     Configuration Register (00h, Read/Write)
        1. Table 4. Configuration Register (00h, Read/Write) Descriptions
        2. 8.6.1.1   AVG Bit Settings [11:9]
          1. Table 5. AVG Bit Settings [11:9] Description
        3. 8.6.1.2   VBUS CT Bit Settings [8:6]
          1. Table 6. VBUS CT Bit Settings [8:6] Description
        4. 8.6.1.3   VSH CT Bit Settings [5:3]
          1. Table 7. Register Description VSH CT Bit Settings [5:3]
        5. 8.6.1.4   Mode Settings [2:0]
          1. Table 8. Mode Settings [2:0]
      3. 8.6.2     Shunt Voltage Register (01h, Read-Only)
        1. Table 9. Shunt Voltage Register (01h, Read-Only) Description
      4. 8.6.3     Bus Voltage Register (02h, Read-Only)
        1. Table 10. Bus Voltage Register (02h, Read-Only) Description
      5. 8.6.4     Power Register (03h, Read-Only)
        1. Table 11. Power Register (03h, Read-Only) Description
      6. 8.6.5     Current Register (04h, Read-Only)
        1. Table 12. Current Register (04h, Read-Only) Description
      7. 8.6.6     Calibration Register (05h, Read/Write)
        1. Table 13. Calibration Register (05h, Read/Write) Description
      8. 8.6.7     Mask/Enable Register (06h, Read/Write)
        1. Table 14. Mask/Enable Register (06h, Read/Write) Description
      9. 8.6.8     Alert Limit Register (07h, Read/Write)
        1. Table 15. Alert Limit Register (07h, Read/Write) Description
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Filtering and Input Considerations
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|12
  • YFD|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.