SBOS644C February   2013  – March 2018 INA231

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      High-or Low-Side Sensing
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: I2C Bus
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic Analog-to-Digital Converter (ADC) Functions
        1. 8.3.1.1 Power Calculation
        2. 8.3.1.2 ALERT Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging and Conversion Time Considerations
    5. 8.5 Programming
      1. 8.5.1 Configure, Measure, and Calculate Example
      2. 8.5.2 Programming the Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default INA231 Settings
      5. 8.5.5 Writing to and Reading from the INA231
        1. 8.5.5.1 Bus Overview
          1. 8.5.5.1.1 Serial Bus Address
          2. 8.5.5.1.2 Serial Interface
        2. 8.5.5.2 High-Speed I2C Mode
      6. 8.5.6 SMBus Alert Response
    6. 8.6 Register Maps
      1. Table 3. Summary of Register Set
      2. 8.6.1     Configuration Register (00h, Read/Write)
        1. Table 4. Configuration Register (00h, Read/Write) Descriptions
        2. 8.6.1.1   AVG Bit Settings [11:9]
          1. Table 5. AVG Bit Settings [11:9] Description
        3. 8.6.1.2   VBUS CT Bit Settings [8:6]
          1. Table 6. VBUS CT Bit Settings [8:6] Description
        4. 8.6.1.3   VSH CT Bit Settings [5:3]
          1. Table 7. Register Description VSH CT Bit Settings [5:3]
        5. 8.6.1.4   Mode Settings [2:0]
          1. Table 8. Mode Settings [2:0]
      3. 8.6.2     Shunt Voltage Register (01h, Read-Only)
        1. Table 9. Shunt Voltage Register (01h, Read-Only) Description
      4. 8.6.3     Bus Voltage Register (02h, Read-Only)
        1. Table 10. Bus Voltage Register (02h, Read-Only) Description
      5. 8.6.4     Power Register (03h, Read-Only)
        1. Table 11. Power Register (03h, Read-Only) Description
      6. 8.6.5     Current Register (04h, Read-Only)
        1. Table 12. Current Register (04h, Read-Only) Description
      7. 8.6.6     Calibration Register (05h, Read/Write)
        1. Table 13. Calibration Register (05h, Read/Write) Description
      8. 8.6.7     Mask/Enable Register (06h, Read/Write)
        1. Table 14. Mask/Enable Register (06h, Read/Write) Description
      9. 8.6.8     Alert Limit Register (07h, Read/Write)
        1. Table 15. Alert Limit Register (07h, Read/Write) Description
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Filtering and Input Considerations
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|12
  • YFD|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (August 2017) to C Revision

  • Added B version device and associated content Go

Changes from A Revision (June 2017) to B Revision

  • Changed NC pin description from "No internal connection" to "Do not connect, leave floating" Go
  • Changed SCL max value from VS + 0.3 V to 6 V in Absolute Maximum Ratings tableGo
  • Added text to end of Layout Guidelines section clarifying no connection of NC pinsGo

Changes from * Revision (February 2013) to A Revision

  • Added Device Information, Recommended Operating Conditions, and ESD Ratings tables, and Detailed Description , Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sectionsGo
  • Added new WSCP-12 (YFD) package with 0.4-mm package height and associated content to data sheetGo
  • Added operating ambient temperature, TA to Absolute Maximum Ratings tableGo
  • Added new note 1 to Timing Requirements: I2C Bus section Go
  • Added test condition to Figure 2 Go