SLLSF09E December   2017  – January 2020 ISO1042

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions—16 Pins
    2.     Pin Functions—8 Pins
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Transient Immunity
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Ratings
    7. 6.7  Insulation Specifications
    8. 6.8  Safety-Related Certifications
    9. 6.9  Safety Limiting Values
    10. 6.10 Electrical Characteristics - DC Specification
    11. 6.11 Switching Characteristics
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CAN Bus States
      2. 8.3.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 8.3.3 Protection Features
        1. 8.3.3.1 TXD Dominant Timeout (DTO)
        2. 8.3.3.2 Thermal Shutdown (TSD)
        3. 8.3.3.3 Undervoltage Lockout and Default State
        4. 8.3.3.4 Floating Pins
        5. 8.3.3.5 Unpowered Device
        6. 8.3.3.6 CAN Bus Short Circuit Current Limiting
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
    3. 9.3 DeviceNet Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWV|8
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DW Package
16-Pin SOIC
Top View

Pin Functions—16 Pins

PIN I/O DESCRIPTION
NO. NAME
1 VCC1 — Digital-side supply voltage, Side 1
2 GND1 — Digital-side ground connection, Side 1
3 TXD I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
4 NC — Not connected
5 RXD O CAN receive data output (LOW for dominant and HIGH for recessive bus states)
6 NC — Not connected
7 NC — Not connected
8 GND1 — Digital-side ground connection, Side 1
9 GND2 — Transceiver-side ground connection, Side 2
10
11 VCC2 — Transceiver-side supply voltage, Side 2. Must be externally connected to pin 16.
12 CANL I/O Low-level CAN bus line
13 CANH I/O High-level CAN bus line
14 NC — Not connected
15 GND2 — Transceiver-side ground connection, Side 2
16 VCC2 — Transceiver-side supply voltage, Side 2. Must be externally connected to pin 11.
DWV Package
8-Pin SOIC
Top View

Pin Functions—8 Pins

PIN I/O DESCRIPTION
NO. NAME
1 VCC1 — Digital-side supply voltage, Side 1
2 TXD I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
3 RXD O CAN receive data output (LOW for dominant and HIGH for recessive bus states)
4 GND1 — Digital-side ground connection, Side 1
5 GND2 — Transceiver-side ground connection, Side 2
6 CANL I/O Low-level CAN bus line
7 CANH I/O High-level CAN bus line
8 VCC2 — Transceiver-side supply voltage, Side 2