SLLS897E March   2008  – June 2015 ISO1176

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ISODE-Pin
    6. 7.6  Supply Current
    7. 7.7  Electrical Characteristics: Driver
    8. 7.8  Electrical Characteristics: Receiver
    9. 7.9  Power Dissipation Characteristics
    10. 7.10 Switching Characteristics: Driver
    11. 7.11 Switching Characteristics: Receiver
    12. 7.12 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Insulation and Safety-Related Package Characteristics
      2. 9.3.2 DIN V VDE V 0884-10 Insulation Characteristics
      3. 9.3.3 IEC 60664-1 Ratings Table
      4. 9.3.4 Safety Limiting Values
      5. 9.3.5 Regulatory Information
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Transient Voltages
        2. 10.2.2.2 ISO1176 “Sticky Bit” Issue (Under Certain Conditions)
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Power Supply Recommendations

To ensure reliable operation at all data rates and supply voltages, TI recommends a 0.1-μF bypass capacitor at input and output supply pins (VCC1 and VCC2). The capacitors should be placed as close to the supply pins as possible. If only a single primary-side power supply is available in an application, isolated power can be generated for the secondary-side with the help of a transformer driver such as TI's SN6501. For such applications, detailed power supply design and transformer selection recommendations are available in SN6501 data sheet (SLLSEA0).