SLLS897E March   2008  – June 2015 ISO1176

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ISODE-Pin
    6. 7.6  Supply Current
    7. 7.7  Electrical Characteristics: Driver
    8. 7.8  Electrical Characteristics: Receiver
    9. 7.9  Power Dissipation Characteristics
    10. 7.10 Switching Characteristics: Driver
    11. 7.11 Switching Characteristics: Receiver
    12. 7.12 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Insulation and Safety-Related Package Characteristics
      2. 9.3.2 DIN V VDE V 0884-10 Insulation Characteristics
      3. 9.3.3 IEC 60664-1 Ratings Table
      4. 9.3.4 Safety Limiting Values
      5. 9.3.5 Regulatory Information
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Transient Voltages
        2. 10.2.2.2 ISO1176 “Sticky Bit” Issue (Under Certain Conditions)
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (March 2010) to E Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • VDE standard changed to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12Go
  • Changed the IEC 60664-1 Ratings Table. Basic isolation group SPECIFICATION entry From: IIIa To: IIGo

Changes from C Revision (October 2008) to D Revision

  • Added 560-Vpeak VIORM to the first Features ListGo
  • Added UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2), to the Features ListGo
  • Added Input pulse width MIN = 10 ns to the RECOMMENDED OPERATING CONDITIONS tableGo
  • Added the CSA column to the Regulatory Information tableGo
  • Changed the ISO1176 “Sticky Bit” Issue sectionGo

Changes from B Revision (June 2008) to C Revision

  • Changed the text in the second paragraph of the DESCRIPTION From: "whenever the driver is disabled or VCC2 = 0" To: "allowing up to 160 nodes."Go

Changes from A Revision (May 2008) to B Revision

  • Changed L(IO1), Minimum air gap (Clearance) in the PACKAGE CHARACTERISTICS table From: MIN = 7.7mm To: 8.34mm.Go

Changes from * Revision (March 2008) to A Revision

  • Added 3.3-V Inputs are 5-V Tolerant to the Features ListGo
  • Added the Bus-Pin ESD Protection bullet and sub bullets to the Features ListGo
  • Added Bus pins to GND1 and Bus pins to GND2 to the ESD information in the Handling Rating tableGo
  • Added the APPLICATION INFORMATION sectionGo